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AM6234ATCGHAALW

Texas Instruments

AM6234ATCGHAALW by Texas Instruments

AM6234ATCGHAALW by Texas Instruments is a SoC peripheral IC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch and low profile components.

Median Price

$28.880

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,250 parts In-Stock

1+ parts

$18.703

100+ parts

$16.337

1k+ parts

$11.267

10k+ parts

-

2,250

$18.703

$16.337

$11.267

-

DigiKey

USA . 261 parts In-Stock

1+ parts

$28.880

100+ parts

$21.924

1k+ parts

$19.434

10k+ parts

-

261

$28.880

$21.924

$19.434

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$28.880

100+ parts

$21.930

1k+ parts

$19.430

10k+ parts

-

2

$28.880

$21.930

$19.430

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 176 parts In-Stock

1+ parts

$17.768

100+ parts

-

1k+ parts

-

10k+ parts

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176

$17.768

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Vyrian

USA . 2,725 parts In-Stock

1+ parts

-

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-

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2,725

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-

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VNN

France . 1,087 parts In-Stock

1+ parts

-

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1,087

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Nova Conductors

Japan . 58 parts In-Stock

1+ parts

-

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58

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 998 parts In-Stock

1+ parts

$15.900

100+ parts

-

1k+ parts

-

10k+ parts

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998

$15.900

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-

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Semicontronic

India . 830 parts In-Stock

1+ parts

$15.900

100+ parts

$15.502

1k+ parts

$15.423

10k+ parts

-

830

$15.900

$15.502

$15.423

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Corphita

USA . 1,387 parts In-Stock

1+ parts

$16.833

100+ parts

-

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-

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1,387

$16.833

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Parana Technologies

USA . 126 parts In-Stock

1+ parts

$47.053

100+ parts

-

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-

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126

$47.053

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-

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DigiPath Technology Company

USA . 1,626 parts In-Stock

1+ parts

$51.812

100+ parts

$47.667

1k+ parts

-

10k+ parts

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1,626

$51.812

$47.667

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ChromeModa Solutions

Germany . 3,534 parts In-Stock

1+ parts

$52.869

100+ parts

$43.353

1k+ parts

-

10k+ parts

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3,534

$52.869

$43.353

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IDEA Electronic Components Group

UK . 162 parts In-Stock

1+ parts

$52.869

100+ parts

$50.226

1k+ parts

$47.582

10k+ parts

-

162

$52.869

$50.226

$47.582

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Corohmni

South Africa . 372 parts In-Stock

1+ parts

$57.054

100+ parts

-

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372

$57.054

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-

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Argo Parts USA

USA . 1,665 parts In-Stock

1+ parts

-

100+ parts

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1,665

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Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

-

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500

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Continental Prestige Electronics

USA . 123 parts In-Stock

1+ parts

-

100+ parts

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123

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Overview

Elevate your electronics with the AM6234ATCGHAALW by Texas Instruments. With a reputation for exceptional quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this innovative Other Function uPs,uCs & Peripheral ICs category product. From its sleek package body material to its advanced terminal form, this IC offers unparalleled value and performance. Perfect for a wide range of applications, this versatile chip is designed to meet all your electronic needs. Invest in excellence with the AM6234ATCGHAALW and experience the difference Texas Instruments can make in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 0.79 V

Operates within a safe voltage range, reducing the risk of overheating or damage to the components.

Package Shape: SQUARE

Optimal shape for efficiently utilizing space on the PCB, contributing to a more compact and streamlined design.

No. of Terminals: 425

Offers a high level of connectivity options, allowing for versatile integration with other electronic components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high-density packaging and fine pitch connections, maximizing functionality in a small form factor.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, making it suitable for a wide range of applications and settings.

Width: 13 mm

Compact width size allows for flexibility in placement on the PCB, ideal for designs with space constraints.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for efficient power consumption and high-speed performance.

Terminal Form: BALL

Ball terminals provide secure and reliable connections, ensuring stable functionality and reducing the risk of signal loss.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6234ATCGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6234ATCGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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