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FT245RQ-TRAY

FTDI

FT245RQ-TRAY by FTDI

FT245RQ-TRAY by FTDI is a 32-terminal chip carrier with a square package shape. It operates b/w -40 to 85 °C, suitable for industrial use. With a terminal pitch of 0.5 mm, it is ideal for microprocessor circuits requiring supply voltage b/w 3.3 V to 5.25 V.

Median Price

$3.550

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$3.550

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Vyrian

USA . 2,661 parts In-Stock

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Bristol Electronics

USA . 14 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 6 parts In-Stock

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$3.479

100+ parts

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$3.340

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100

$3.479

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Argo Parts USA

USA . 3,949 parts In-Stock

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$3.550

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Continental Prestige Electronics

USA . 3,638 parts In-Stock

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$3.550

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$3.479

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$3.550

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$3.479

AZTECH Wire

Italy . 282 parts In-Stock

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$16.668

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282

$16.668

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Aztec Data Supply Inc.

USA . 2,401 parts In-Stock

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$32.930

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Glotronic Ltd.

UK . 75 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 45 parts In-Stock

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Overview

Unlock unparalleled performance with the FT245RQ-TRAY by FTDI, a cutting-edge solution in the realm of Other Function uPs,uCs & Peripheral ICs. Crafted with precision and expertise by FTDI, this surface-mountable marvel boasts a wide operating temperature range and a compact design, making it ideal for various industrial applications. With a maximum supply voltage of 5.25 V and a minimum of 3.3 V, this microprocessor circuit ensures optimal functionality and reliability. Embrace innovation and elevate your projects with the FT245RQ-TRAY today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly during production.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power input options and can handle higher voltage applications.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the PCB and allows for a compact design.

Minimum Supply Voltage: 3.3 V

Lower minimum supply voltage allows for operation in low power settings and can help in reducing overall power consumption.

Maximum Operating Temperature: 85 °C

Higher maximum operating temperature ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for operation in extreme cold conditions.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles provide options for different application requirements and offer flexibility in design.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of microprocessor circuit in the peripheral IC enhances the processing capabilities of the product, making it suitable for complex functions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs FT245RQ-TRAY attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from FTDI

Specs

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Peripheral IC Type:

Trade Compliance

FT245RQ-TRAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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