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RF430FRL152HCRGER

Texas Instruments

RF430FRL152HCRGER by Texas Instruments

RF430FRL152HCRGER by Texas Instruments is a MICROPROCESSOR CIRCUIT with I2C and SPI compatibility. It features 24 terminals in a SQUARE CHIP CARRIER package style, suitable for COMMERCIAL applications. With an operating temperature range of 0-70°C and compact dimensions of 4x4mm, it's ideal for various electronic devices.

Median Price

$4.045

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,529 parts In-Stock

1+ parts

$2.628

100+ parts

$2.142

1k+ parts

$1.428

10k+ parts

-

10,529

$2.628

$2.142

$1.428

-

Chip1Stop

Japan . 2,935 parts In-Stock

1+ parts

$4.040

100+ parts

$3.010

1k+ parts

$2.210

10k+ parts

$1.920

2,935

$4.040

$3.010

$2.210

$1.920

DigiKey

USA . 1,986 parts In-Stock

1+ parts

$4.050

100+ parts

$3.049

1k+ parts

$2.675

10k+ parts

$2.521

1,986

$4.050

$3.049

$2.675

$2.521

Mouser Electronics

USA . 1,866 parts In-Stock

1+ parts

$4.050

100+ parts

$3.050

1k+ parts

$2.330

10k+ parts

$2.240

1,866

$4.050

$3.050

$2.330

$2.240

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 96 parts In-Stock

1+ parts

$2.142

100+ parts

-

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96

$2.142

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-

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Digiode

USA . 1,707 parts In-Stock

1+ parts

$2.497

100+ parts

-

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1,707

$2.497

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Chip Stock

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Vyrian

USA . 4,421 parts In-Stock

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4,421

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,696 parts In-Stock

1+ parts

$2.142

100+ parts

-

1k+ parts

-

10k+ parts

$2.099

1,696

$2.142

-

-

$2.099

Argo Parts USA

USA . 1,087 parts In-Stock

1+ parts

$2.142

100+ parts

-

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-

10k+ parts

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1,087

$2.142

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.142

100+ parts

-

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100

$2.142

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-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.185

100+ parts

$2.185

1k+ parts

$2.185

10k+ parts

-

1,000

$2.185

$2.185

$2.185

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Semicontronic

India . 4,282 parts In-Stock

1+ parts

$2.230

100+ parts

$2.174

1k+ parts

$2.163

10k+ parts

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4,282

$2.230

$2.174

$2.163

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Corphita

USA . 2,316 parts In-Stock

1+ parts

$2.365

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2,316

$2.365

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Ampacity Inc.

Singapore . 4,650 parts In-Stock

1+ parts

$4.860

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4,650

$4.860

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Microchip USA

USA . 2,478 parts In-Stock

1+ parts

$12.468

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2,478

$12.468

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Parana Technologies

USA . 425 parts In-Stock

1+ parts

$40.087

100+ parts

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425

$40.087

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DigiPath Technology Company

USA . 1,420 parts In-Stock

1+ parts

$44.141

100+ parts

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1,420

$44.141

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ChromeModa Solutions

Germany . 4,530 parts In-Stock

1+ parts

$45.042

100+ parts

$36.934

1k+ parts

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10k+ parts

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4,530

$45.042

$36.934

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IDEA Electronic Components Group

UK . 654 parts In-Stock

1+ parts

$45.042

100+ parts

$42.790

1k+ parts

$40.538

10k+ parts

-

654

$45.042

$42.790

$40.538

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Corohmni

South Africa . 615 parts In-Stock

1+ parts

$84.267

100+ parts

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615

$84.267

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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Lixinc

USA . 873 parts In-Stock

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873

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Overview

Experience the unmatched quality and innovation of Texas Instruments with the RF430FRL152HCRGER, a cutting-edge microprocessor circuit that offers endless possibilities in various applications. With a sleek chip carrier package and advanced CMOS technology, this peripheral IC delivers superior performance and reliability. Whether you're designing IoT devices or wearable tech, this product's I2C and SPI bus compatibility ensures seamless integration. Trust Texas Instruments for top-of-the-line solutions that bring value and efficiency to your projects. Elevate your designs with the RF430FRL152HCRGER today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and protection for the internal components of the IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards.

Package Shape: SQUARE

Square shape helps optimize space usage on the circuit board.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for various functions and peripherals.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile chip carrier style helps in reducing overall product size and weight.

Maximum Operating Temperature: 70 °C

High operating temperature range ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: 0 °C

Lowest operating temperature of 0°C allows for operation in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish offers excellent conductivity and resistance to corrosion.

Terminal Position: QUAD

Quad terminal position provides stability and secure connection to the circuit board.

Maximum Seated Height: 1 mm

Low seated height aids in compact design and efficient use of space.

Width: 4 mm

Narrow width allows for placement in tight spaces on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and connection.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables secure soldering of the IC onto the circuit board.

Length: 4 mm

Short length contributes to the overall compactness of the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes this IC suitable for typical commercial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type allows for handling complex functions and tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations.

Bus Compatibility: I2C; SPI

Support for I2C and SPI bus compatibility enables easy integration with other devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for precise connections and high-density mounting.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, suitable for standard handling and storage precautions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs RF430FRL152HCRGER attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE

Bus Compatibility:

I2C; SPI

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

RF430FRL152HCRGER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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