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RF430FRL151HCRGER

Texas Instruments

RF430FRL151HCRGER by Texas Instruments

The Texas Instruments RF430FRL151HCRGER is a CMOS microprocessor circuit with 24 terminals in a square chip carrier package. Operating temperature range of 0-70°C makes it suitable for commercial applications. With surface mount capability and very thin profile, it's ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,202 parts In-Stock

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4,202

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Digiode

USA . 932 parts In-Stock

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932

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Distributors (Availability)

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AZTECH Wire

Italy . 422 parts In-Stock

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$13.340

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422

$13.340

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One Stop Electronics

USA . 1,577 parts In-Stock

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$35.000

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1,577

$35.000

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Corohmni

South Africa . 409 parts In-Stock

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$57.794

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409

$57.794

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Parana Technologies

USA . 1,459 parts In-Stock

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$75.414

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1,459

$75.414

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ChromeModa Solutions

Germany . 6,831 parts In-Stock

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$84.735

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$69.483

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6,831

$84.735

$69.483

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IDEA Electronic Components Group

UK . 1,418 parts In-Stock

1+ parts

$84.735

100+ parts

$80.498

1k+ parts

$76.262

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1,418

$84.735

$80.498

$76.262

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Corphita

USA . 2,807 parts In-Stock

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2,807

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DigiPath Technology Company

USA . 839 parts In-Stock

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$76.397

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839

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$76.397

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Overview

Elevate your projects with the RF430FRL151HCRGER by Texas Instruments, a cutting-edge peripheral IC that promises top-tier performance and reliability. Boasting a sleek package style and advanced technology, this microprocessor circuit is the ideal solution for a wide range of applications. With Texas Instruments' renowned reputation for quality and innovation, you can trust that this product offers unparalleled value and benefits. Upgrade your designs today with the RF430FRL151HCRGER and experience the advantages of working with a leader in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the IC, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology offers space-saving benefits and allows for easy integration onto circuit boards.

Package Shape: SQUARE

Square package shape helps in efficient placement and routing on the PCB, optimizing space utilization.

No. of Terminals: 24

With 24 terminals, this IC can accommodate multiple connections and interfaces, providing versatility in design.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The chip carrier style with a very thin profile enables compact design and efficient heat dissipation in tight spaces.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance under various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in colder environments without sacrificing functionality.

Terminal Position: QUAD

Quad terminal position offers stable connection points and facilitates easy soldering for secure integration.

Maximum Seated Height: 1 mm

Low seated height profile allows for slim and compact device designs.

Width: 4 mm

Narrow width makes the IC suitable for applications where space is limited.

Length: 4 mm

Compact length ensures the IC can fit into small form factor devices.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where stability and performance are essential.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit functionality enhances processing capabilities and performance of the IC.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high speed operation.

Terminal Form: NO LEAD

No lead terminal form provides environmental benefits and reduces the risk of lead contamination.

Terminal Pitch: 0.5 mm

Close terminal pitch enables high-density packaging and efficient signal transmission.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs RF430FRL151HCRGER attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

RF430FRL151HCRGER Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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