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RF430FRL151HSRGER

Texas Instruments

RF430FRL151HSRGER by Texas Instruments

RF430FRL151HSRGER by Texas Instruments is a CMOS microprocessor circuit with 24 terminals in a square chip carrier package. Operating temperature range of 0-70°C makes it suitable for commercial applications. With a very thin profile and no lead terminal form, it is ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,863 parts In-Stock

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2,863

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Vyrian

USA . 2,150 parts In-Stock

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2,150

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Distributors (Availability)

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AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$7.457

100+ parts

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578

$7.457

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Corohmni

South Africa . 2,902 parts In-Stock

1+ parts

$24.222

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2,902

$24.222

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One Stop Electronics

USA . 1,633 parts In-Stock

1+ parts

$26.000

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1,633

$26.000

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Parana Technologies

USA . 2,210 parts In-Stock

1+ parts

$71.256

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2,210

$71.256

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DigiPath Technology Company

USA . 136 parts In-Stock

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$78.462

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136

$78.462

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ChromeModa Solutions

Germany . 5,149 parts In-Stock

1+ parts

$80.063

100+ parts

$65.652

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5,149

$80.063

$65.652

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IDEA Electronic Components Group

UK . 1,129 parts In-Stock

1+ parts

$80.063

100+ parts

$76.060

1k+ parts

$72.057

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1,129

$80.063

$76.060

$72.057

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Corphita

USA . 769 parts In-Stock

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769

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Overview

Unlock the power of innovation with the RF430FRL151HSRGER by Texas Instruments. Crafted with precision and excellence, this cutting-edge microprocessor circuit offers unparalleled performance and reliability for a wide range of applications. From smart home devices to industrial automation, this versatile chip carrier is designed to elevate your projects to new heights. Experience the seamless integration and superior quality that only Texas Instruments can deliver. Discover the endless possibilities and revolutionize your creations with the RF430FRL151HSRGER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability provides easy installation and integration into PCBs, saving space and facilitating automated assembly.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, maximizing component density.

No. of Terminals: 24

Having 24 terminals provides flexibility and allows for multiple connections and functionalities within the IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this IC suitable for use in various environments.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection to the PCB, improving overall reliability and performance.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this IC provides a low profile solution for space-constrained applications.

Width: 4 mm

The compact width of 4 mm enables efficient use of space on the PCB and allows for high component density.

Length: 4 mm

The short length of 4 mm further aids in space-saving design and compact integration into electronic systems.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this IC is designed for standard operating conditions, suitable for most commercial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this IC offers advanced processing capabilities and is ideal for applications requiring complex computations.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance, making this IC energy-efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form simplifies the soldering process and reduces the risk of potential issues associated with lead-based components.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this IC allows for precise connections and enhances overall signal integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs RF430FRL151HSRGER attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

RF430FRL151HSRGER Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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