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RF430FRL153HSRGER

Texas Instruments

RF430FRL153HSRGER by Texas Instruments

RF430FRL153HSRGER by Texas Instruments is a CMOS microprocessor circuit with 24 terminals in a square chip carrier package. Operating temperature range of 0-70°C makes it suitable for commercial applications. With a very thin profile and no lead terminal form, it is ideal for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,759 parts In-Stock

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3,759

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Digiode

USA . 1,054 parts In-Stock

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1,054

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Distributors (Availability)

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AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$15.587

100+ parts

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455

$15.587

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One Stop Electronics

USA . 588 parts In-Stock

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$35.000

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588

$35.000

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Parana Technologies

USA . 331 parts In-Stock

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$60.172

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331

$60.172

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DigiPath Technology Company

USA . 1,255 parts In-Stock

1+ parts

$66.257

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$60.956

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1,255

$66.257

$60.956

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ChromeModa Solutions

Germany . 1,595 parts In-Stock

1+ parts

$67.609

100+ parts

$55.439

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1,595

$67.609

$55.439

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IDEA Electronic Components Group

UK . 893 parts In-Stock

1+ parts

$67.609

100+ parts

$64.229

1k+ parts

$60.848

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893

$67.609

$64.229

$60.848

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Corohmni

South Africa . 5,180 parts In-Stock

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$72.159

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$72.159

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Corphita

USA . 296 parts In-Stock

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Overview

Unlock endless possibilities with the RF430FRL153HSRGER by Texas Instruments. Crafted with precision and expertise, this innovative product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering unmatched quality and reliability. From enhancing security in smart cards to enabling seamless communication in IoT devices, this versatile microprocessor circuit opens doors to a wide range of applications. Experience the value and benefits of this cutting-edge technology, designed to elevate your projects to new heights. Choose Texas Instruments for excellence that surpasses expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the integrated circuit, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and secure installation on a PCB, reducing the overall size of the final product and improving the reliability of the connection.

Package Shape: SQUARE

Square shape makes it easy to mount and align within the circuit design, maximizing space efficiency.

No. of Terminals: 24

Sufficient number of terminals for connecting to multiple components or peripherals, increasing the versatility of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles cater to different design requirements, allowing for flexibility in integration and thermal management.

Maximum Operating Temperature: 70 °C

High operating temperature tolerance ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low operating temperature ensures the product can function in cold environments without issues.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and secure connections, enhancing the stability of the integrated circuit.

Maximum Seated Height: 1 mm

Low seated height enables compact designs and efficient use of space within the system.

Width: 4 mm

Narrow width facilitates easy placement and routing within the circuit layout, optimizing space utilization.

Length: 4 mm

Compact length contributes to the overall small footprint of the product, ideal for applications with limited space available.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications, ensuring compatibility with common environments and requirements.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit enables advanced processing capabilities, making the product suitable for sophisticated applications and functions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the integrated circuit.

Terminal Form: NO LEAD

Lead-free terminals conform to modern environmental regulations and eliminate potential health risks associated with lead contamination.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling more functionality within a limited space and enhancing overall performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs RF430FRL153HSRGER attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

RF430FRL153HSRGER Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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