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XC7Z014S-2CLG400I

Xilinx

XC7Z014S-2CLG400I by Xilinx

The Xilinx XC7Z014S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

Median Price

$154.825

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Mouser Electronics

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DigiKey

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Digiode

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Nova Conductors

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AZTECH Wire

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Aztec Data Supply Inc.

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Modulus Dynamics

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One Stop Electronics

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Vigor

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Continental Prestige Electronics

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Netroflash

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Texas Native Microelectronics

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Microchip USA

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Kenton Components

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Overview

Unlock limitless possibilities with the XC7Z014S-2CLG400I by Xilinx. This cutting-edge system on chip is a game-changer in the world of Other Function uPs,uCs & Peripheral ICs, offering unparalleled quality and reliability. With Xilinx's reputation for innovation and superior technology, this product delivers exceptional performance across a wide range of applications. Experience seamless integration, unmatched efficiency, and endless opportunities for growth with the XC7Z014S-2CLG400I. Elevate your projects to new heights and stay ahead of the curve with this groundbreaking solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal stability and low cost, making it a durable choice for the package body.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

Maximum Supply Voltage: 1.05 V

With a maximum supply voltage of 1.05V, this product is well-suited for low-power applications, helping to conserve energy.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, maximizing component density.

No. of Terminals: 400

Having 400 terminals provides a high level of connectivity, allowing for versatile integration into various systems and applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style enhances signal integrity and reduces signal distortion, improving overall performance.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage of 0.95V allows for operation in low-power conditions, offering flexibility in power management.

Maximum Operating Temperature: 100 °C

High maximum operating temperature of 100°C ensures reliability and stability even in extreme conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range of -40°C enables usage in harsh environments with varying temperatures.

Terminal Position: BOTTOM

Bottom terminal position facilitates efficient routing of signal paths and simplifies board layout for improved signal integrity.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm minimizes space requirements and enables compact designs for applications with size constraints.

Width: 17 mm

A width of 17mm allows for easy integration into standard circuit board layouts, ensuring compatibility with existing designs.

Length: 17 mm

Length of 17mm provides a balanced form factor, suitable for a wide range of applications without sacrificing performance or functionality.

Peripheral IC Type: SYSTEM ON CHIP

System on chip (SoC) design integrates multiple functions onto a single chip, improving efficiency, reducing power consumption, and enhancing overall system performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers high-speed operation, low power consumption, and reliable performance, ideal for modern electronic devices.

Terminal Form: BALL

Ball terminal form provides secure connections and efficient heat dissipation, ensuring stable and reliable operation in demanding applications.

Nominal Supply Voltage: 1 V

Nominal supply voltage of 1V provides a stable and consistent power source for the device, contributing to reliable and consistent performance.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm enables high-density mounting, allowing for more compact designs and increased functionality in limited spaces.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z014S-2CLG400I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

Length:

17 mm

No. of Terminals:

400

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z014S-2CLG400I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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