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MCIMX515DJM8CR2

NXP Semiconductors

MCIMX515DJM8CR2 by NXP Semiconductors

MCIMX515DJM8CR2 by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -20 to 85 °C. It has a supply voltage range of 1.05V to 1.2V and uses BALL terminal form for various applications requiring low profile, fine pitch package style in electronics industry.

Median Price

$53.390

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

MCIMX515DJM8CR2 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 44,607 parts In-Stock

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DigiKey

USA . 27,750 parts In-Stock

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Verical

USA . 27,360 parts In-Stock

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$61.656

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Rochester

USA . 11,232 parts In-Stock

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$50.050

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$44.780

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$42.140

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$42.140

Distributors (In-Stock)

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Digiode

USA . 2,731 parts In-Stock

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$44.014

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Nova Conductors

Japan . 15 parts In-Stock

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$51.539

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Flip Electronics

USA . 29,187 parts In-Stock

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Vyrian

USA . 26,461 parts In-Stock

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Anansix

USA . 1,350 parts In-Stock

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Chip Stock

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Sensible Micro Corp

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Distributors (Availability)

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One Stop Electronics

USA . 22,558 parts In-Stock

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$34.370

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Ampacity Inc.

Singapore . 22,444 parts In-Stock

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Semicontronic

India . 19,344 parts In-Stock

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$39.380

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$38.396

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$38.199

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Corphita

USA . 4,405 parts In-Stock

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$41.697

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Continental Prestige Electronics

USA . 473 parts In-Stock

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$51.539

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$50.509

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Corohmni

South Africa . 993 parts In-Stock

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$65.723

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Aztec Data Supply Inc.

USA . 583 parts In-Stock

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$73.020

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Microchip USA

USA . 1,981 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,357 parts In-Stock

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Perfect Parts

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Netroflash

USA . 500 parts In-Stock

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$48.962

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$47.932

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

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Overview

Discover the cutting-edge MCIMX515DJM8CR2 by NXP Semiconductors, a top-tier manufacturer known for delivering high-quality products. This innovative device falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications for various industries. With its advanced technology and superior performance, this product provides unmatched value, benefits, and advantages to customers seeking reliability and efficiency in their projects. Experience the difference with NXP Semiconductors' MCIMX515DJM8CR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring longevity and reliability.

Surface Mount: YES

Surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.15 V

This maximum supply voltage ensures safe operation and prevents damage to the product from overvoltage.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards, making it ideal for compact devices.

Power Supplies (V): 1.2

Stable power supply at 1.2V ensures consistent performance and reliable operation of the product.

No. of Terminals: 529

Large number of terminals provide ample connectivity options for interfacing with other components, enabling versatile applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density mounting with low profile design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.05 V

Having a low minimum supply voltage allows for efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -20 °C

Wide range of operating temperatures allows for use in diverse environments, from extreme cold to hot conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish with multiple metals ensures good conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, enhancing ease of use for manufacturers.

Maximum Seated Height: 1.6 mm

Low profile design with maximum seated height of 1.6mm enables slim and compact device designs.

Width: 19 mm

19mm width provides a compact form factor that can fit into various devices and systems with limited space.

Maximum Time At Peak Reflow Temperature (s): 40

Ability to withstand peak reflow temperatures for up to 40 seconds ensures proper soldering and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability of 260°C meets industry standards for lead-free soldering, ensuring reliability.

Length: 19 mm

19mm length offers a balanced aspect ratio with width, facilitating seamless integration into various electronic designs.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip integration enhances performance, reduces system complexity, and saves space on the PCB, making it a cost-effective solution.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, ensuring efficiency and compatibility.

Terminal Form: BALL

Ball terminal form provides reliable solder connections, withstands mechanical stress, and simplifies rework processes.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage of 1.1V ensures consistent performance and reliable operation under typical operating conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting and efficient use of PCB space, ideal for compact designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture during handling, storage, and assembly, requiring standard precautions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX515DJM8CR2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX515DJM8CR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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