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MCIMX6S5EVM10AB

NXP Semiconductors

MCIMX6S5EVM10AB by NXP Semiconductors

MCIMX6S5EVM10AB by NXP Semiconductors is a low-profile, fine-pitch GRID ARRAY SoC with 624 terminals. It operates b/w -20 to 105 °C and has a supply voltage range of 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$41.705

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 200 parts In-Stock

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$24.530

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$24.530

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DigiKey

USA . 264 parts In-Stock

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$51.860

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$37.682

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$51.860

$37.682

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Mouser Electronics

USA . 50 parts In-Stock

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$51.860

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$37.690

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$51.860

$37.690

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Flip Electronics (Authorized)

USA . 480 parts In-Stock

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Rochester

USA . 300 parts In-Stock

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$31.550

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$28.230

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$26.570

300

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$31.550

$28.230

$26.570

Distributors (In-Stock)

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Bristol Electronics

USA . 424 parts In-Stock

1+ parts

$24.387

100+ parts

$21.573

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$19.997

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424

$24.387

$21.573

$19.997

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Digiode

USA . 242 parts In-Stock

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$27.750

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$27.750

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Nova Conductors

Japan . 10 parts In-Stock

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$34.900

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$34.900

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Anansix

USA . 2,532 parts In-Stock

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Flip Electronics

USA . 1,961 parts In-Stock

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Semtec, LLC

USA . 1,613 parts In-Stock

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Chip Stock

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ACDS - Activité Composants Distribution Service

France . 424 parts In-Stock

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Dan-Mar Components

USA . 424 parts In-Stock

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424

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Vyrian

USA . 348 parts In-Stock

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348

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LIBRA Elektronik GmbH

Germany . 6 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 1,889 parts In-Stock

1+ parts

$17.330

100+ parts

$15.880

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$17.330

$15.880

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Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$20.339

100+ parts

$20.136

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$19.322

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800

$20.339

$20.136

$19.322

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One Stop Electronics

USA . 348 parts In-Stock

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$23.140

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348

$23.140

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Corphita

USA . 2,124 parts In-Stock

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$26.289

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Corohmni

South Africa . 4,902 parts In-Stock

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$33.778

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$33.778

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Aranea Global

USA . 500 parts In-Stock

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$34.202

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$32.834

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$34.202

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$32.834

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Continental Prestige Electronics

USA . 6,404 parts In-Stock

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$34.900

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$34.202

6,404

$34.900

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$34.202

Aztec Data Supply Inc.

USA . 559 parts In-Stock

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$38.143

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$38.143

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Ampacity Inc.

Singapore . 348 parts In-Stock

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$50.370

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348

$50.370

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Semicontronic

India . 54 parts In-Stock

1+ parts

$50.370

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$49.111

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$48.859

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$50.370

$49.111

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Microchip USA

USA . 1,227 parts In-Stock

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$104.535

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Lixinc

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Perfect Parts

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UNI Independent Distributors

Spain . 2,845 parts In-Stock

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Argo Parts USA

USA . 2,473 parts In-Stock

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Futuretech Components

Singapore . 1,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 111 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 11 parts In-Stock

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Overview

Experience the unmatched quality and reliability of NXP Semiconductors with the MCIMX6S5EVM10AB. This cutting-edge product falls under the category of Other Function uPs, uCs & Peripheral ICs, making it versatile for a wide range of applications. With its advanced technology and innovative design, this package offers customers exceptional value and performance. Say goodbye to compromises and hello to seamless integration with the MCIMX6S5EVM10AB from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, making it suitable for automated assembly processes.

Maximum Supply Voltage: 1.5 V

Suitable for low power applications, helping to conserve energy and reduce operating costs.

Package Shape: SQUARE

Helps with efficient use of space on a PCB, especially in applications where real estate is limited.

No. of Terminals: 624

Provides ample connectivity options for various peripherals and external components, allowing for versatile functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables high density packaging, making it suitable for compact electronic devices and applications where space is a premium.

Minimum Supply Voltage: 1.35 V

Allows for operation in low power conditions, ideal for battery-powered devices or applications with strict power requirements.

Maximum Operating Temperature: 105 °C

Ensures reliable operation even in high temperature environments, making it suitable for industrial or outdoor applications.

Minimum Operating Temperature: -20 °C

Can withstand cold temperature conditions, providing versatility in deployment across different climates and environments.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and corrosion resistance, maintaining signal integrity and reliability over time.

Terminal Position: BOTTOM

Facilitates secure PCB mounting and connection, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1.6 mm

Offers a low profile design, suitable for applications where space constraints or height limitations are a concern.

Width: 21 mm

Provides a compact form factor, enabling integration into small or portable electronic devices.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for efficient and reliable soldering during assembly, ensuring proper connection and functionality.

Peak Reflow Temperature °C: 260

Can withstand high temperature soldering processes, ensuring secure and durable connections on the PCB.

Length: 21 mm

Complements the square package shape, contributing to a space-saving design for compact electronic devices.

Peripheral IC Type: SoC

Integration of multiple functionalities into a single chip, reducing the need for external components and simplifying the overall design.

Technology: CMOS

Provides low power consumption and high noise immunity, ideal for energy-efficient and reliable electronic systems.

Terminal Form: BALL

Facilitates reliable soldering and connection to the PCB, ensuring stable operation and signal integrity.

Terminal Pitch: 0.8 mm

Enables high-density packaging and fine-pitch interconnection, suitable for compact designs and miniaturized electronics.

Moisture Sensitivity Level (MSL): 3

Indicates a moderate level of moisture sensitivity, requiring standard handling and storage practices to prevent damage during assembly and operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S5EVM10AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6S5EVM10AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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