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MCIMX286CVM4CR2

NXP Semiconductors

MCIMX286CVM4CR2 by NXP Semiconductors

MCIMX286CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.

Median Price

$15.676

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$15.676

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900

$15.676

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Digiode

USA . 462 parts In-Stock

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462

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Anansix

USA . 357 parts In-Stock

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357

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Vyrian

USA . 315 parts In-Stock

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315

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Distributors (Availability)

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AZTECH Wire

Italy . 350 parts In-Stock

1+ parts

$13.238

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350

$13.238

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Continental Prestige Electronics

USA . 2,357 parts In-Stock

1+ parts

$15.676

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$15.363

2,357

$15.676

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$15.363

Netroflash

USA . 100 parts In-Stock

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$15.676

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100

$15.676

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$15.813

100+ parts

$14.548

1k+ parts

$13.632

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550

$15.813

$14.548

$13.632

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One Stop Electronics

USA . 1,209 parts In-Stock

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$23.000

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$23.000

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Ampacity Inc.

Singapore . 370 parts In-Stock

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$35.000

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370

$35.000

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Corohmni

South Africa . 1,944 parts In-Stock

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$39.626

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Microchip USA

USA . 2,090 parts In-Stock

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$48.183

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$48.183

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Aztec Data Supply Inc.

USA . 4,643 parts In-Stock

1+ parts

$52.230

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4,643

$52.230

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Argo Parts USA

USA . 2,892 parts In-Stock

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Corphita

USA . 2,334 parts In-Stock

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UNI Independent Distributors

Spain . 138 parts In-Stock

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Overview

Discover the cutting-edge MCIMX286CVM4CR2 by NXP Semiconductors, a game-changing System on Chip that promises unparalleled performance and reliability. As a leader in semiconductor innovation, NXP Semiconductors sets the standard for quality and excellence in the industry. This versatile IC is ideal for a wide range of applications, providing customers with endless possibilities for their projects. Experience the value and benefits of this advanced technology, from its low profile design to its industrial-grade temperature tolerance. Upgrade your devices today with the MCIMX286CVM4CR2 and unleash the full potential of your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the components inside, making the product reliable in various operating conditions.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the product, saving space and improving overall performance.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand harsh environments and extended usage without compromising on performance.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, making this product energy-efficient and reliable for various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX286CVM4CR2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.37 mm

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX286CVM4CR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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