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XCZU11EG-1FFVC1156E

Xilinx

XCZU11EG-1FFVC1156E by Xilinx

XCZU11EG-1FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it's ideal for applications requiring low power consumption and high performance.

Median Price

$4,054.850

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 60 parts In-Stock

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$4,054.850

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Vyrian

USA . 7,599 parts In-Stock

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VNN

France . 826 parts In-Stock

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Digiode

USA . 350 parts In-Stock

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350

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Semicontronic

India . 801 parts In-Stock

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$5.000

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$4.875

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$4.850

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801

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AZTECH Wire

Italy . 773 parts In-Stock

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$9.830

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773

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Ampacity Inc.

Singapore . 505 parts In-Stock

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$11.000

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$11.000

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One Stop Electronics

USA . 1,441 parts In-Stock

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$27.000

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MARBEL Systems

Belgium . 450 parts In-Stock

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$46.127

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$44.282

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Aztec Data Supply Inc.

USA . 4,336 parts In-Stock

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$51.590

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Corohmni

South Africa . 3,137 parts In-Stock

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$58.700

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Kenton Components

USA . 2,604 parts In-Stock

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$63.624

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$55.989

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Modulus Dynamics

Lithuania . 675 parts In-Stock

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$128.947

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$128.947

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$128.947

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675

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Microchip USA

USA . 1,541 parts In-Stock

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$3,244.248

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Continental Prestige Electronics

USA . 6,166 parts In-Stock

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$3,980.900

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$3,901.282

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Argo Parts USA

USA . 161 parts In-Stock

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$3,980.900

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$3,941.091

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$3,901.282

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$3,861.473

161

$3,980.900

$3,941.091

$3,901.282

$3,861.473

Netroflash

USA . 2,000 parts In-Stock

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$4,054.850

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$3,852.108

10k+ parts

$3,771.011

2,000

$4,054.850

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$3,852.108

$3,771.011

Advanced Electronics

New Zealand . 113 parts In-Stock

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$4,532.062

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$4,169.497

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$3,906.950

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113

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Texas Native Microelectronics

USA . 969 parts In-Stock

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Supply Digital

USA . 764 parts In-Stock

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Qasali Group International

UK . 376 parts In-Stock

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$137.428

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$125.976

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$125.976

Vigor

Singapore . 258 parts In-Stock

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Corphita

USA . 186 parts In-Stock

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Overview

Unlock the power of innovation with the XCZU11EG-1FFVC1156E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers exceptional quality and reliability in their products. This versatile microprocessor circuit offers endless possibilities in various applications, providing customers with unparalleled performance and efficiency. Whether you're looking to enhance your system's capabilities or streamline your operations, the XCZU11EG-1FFVC1156E is sure to deliver value, benefits, and advantages that will exceed your expectations. Elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and resistant to physical damage, making it ideal for portable or rugged applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage ensures stable operation even in demanding power conditions, enhancing reliability and performance of the product.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board, enabling compact designs and optimized layout for better integration.

No. of Terminals: 1156

The large number of terminals provides ample connectivity options, facilitating versatile usage and compatibility with a wide range of devices.

Package Style (Meter): GRID ARRAY

The grid array package style offers good thermal properties and signal integrity, ensuring stable performance even under high-frequency operations.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices, making the product cost-effective and environmentally friendly.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, making the product suitable for industrial or automotive applications.

Minimum Operating Temperature: 0 °C

The wide operating temperature range enables the product to function in both extreme cold and hot environments, enhancing its versatility and durability.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: BOTTOM

The bottom terminal position allows for easy soldering and connection to the circuit board, simplifying installation and maintenance of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature reduces the risk of component damage during soldering process, ensuring product integrity and long-term reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures secure and robust solder joints, improving overall durability and performance of the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of microprocessor circuit as peripheral IC provides advanced computing capabilities and efficient data processing, making the product suitable for high-performance applications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and responsive in demanding applications.

Terminal Form: BALL

The ball terminal form provides good electrical contact and mechanical strength, ensuring secure connections and reducing the risk of signal loss or failure.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V offers a balanced level of power delivery, optimizing performance and efficiency of the product in various operating conditions.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent damage and ensure product reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-1FFVC1156E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-1FFVC1156E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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