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XC7Z010-3CLG400E

Xilinx

XC7Z010-3CLG400E by Xilinx

XC7Z010-3CLG400E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

Median Price

$126.935

Lifecycle Status

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Mouser Electronics

USA . 3 parts In-Stock

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DigiKey

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Digiode

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VNN

France . 616 parts In-Stock

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Nova Conductors

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Aztec Data Supply Inc.

USA . 327 parts In-Stock

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$43.810

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Corohmni

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Vigor

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Modulus Dynamics

Lithuania . 1,260 parts In-Stock

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Texas Native Microelectronics

USA . 925 parts In-Stock

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Semicontronic

India . 2,812 parts In-Stock

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One Stop Electronics

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Corphita

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Continental Prestige Electronics

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$111.710

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Kenton Components

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Ampacity Inc.

Singapore . 981 parts In-Stock

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Lixinc

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Supply Digital

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Netroflash

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GreenTree Electronics

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Qasali Group International

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Overview

Unlock the power of innovation with the XC7Z010-3CLG400E by Xilinx. Known for their superior quality and cutting-edge technology, Xilinx delivers exceptional performance in the field of Other Function uPs,uCs & Peripheral ICs. This versatile product offers endless possibilities for applications, providing customers with value, efficiency, and reliability. Experience seamless integration and optimal functionality with the XC7Z010-3CLG400E, setting new standards in the industry. Elevate your projects to the next level with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can provide good protection for the components inside the package.

Surface Mount: YES

Surface mount components are easier to assemble on a circuit board, saving time and effort during production.

Maximum Supply Voltage: 1.05 V

With a relatively high maximum supply voltage, this product can handle a wide range of operating conditions.

Package Shape: SQUARE

The square shape allows for efficient use of PCB space and can make routing traces easier.

No. of Terminals: 400

Having a large number of terminals allows for more connections and functionality in the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for a compact design with precise connections, making it suitable for high-density applications.

Minimum Supply Voltage: 0.95 V

Having a low minimum supply voltage allows for flexibility in power supply options.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures the product can operate reliably in various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in temperature-sensitive applications.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

This terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position can make soldering and inspection easier during assembly.

Maximum Seated Height: 1.6 mm

The low profile design with maximum seated height of 1.6 mm allows for compact product design.

Width: 17 mm

Compact width makes it easy to fit this product in limited space on a circuit board.

Length: 17 mm

Square shape with a length of 17 mm allows for symmetrical layout on the PCB.

Peripheral IC Type: SYSTEM ON CHIP

This type of IC integrates multiple functions into a single chip, reducing the need for external components and saving board space.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form offers good contact reliability and mechanical strength for the connections.

Nominal Supply Voltage: 1 V

Having a stable nominal supply voltage of 1 V makes it compatible with standard power sources.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm allows for high-density mounting and precise connections on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates this product can withstand multiple reflows during assembly without significant risk of moisture-related damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z010-3CLG400E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z010-3CLG400E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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