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MCIMX351AJQ5C

NXP Semiconductors

MCIMX351AJQ5C by NXP Semiconductors

MCIMX351AJQ5C by NXP Semiconductors is a multifunction peripheral IC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.33V to 1.47V. This low-profile, fine-pitch grid array package is ideal for industrial applications requiring high performance in compact spaces.

Median Price

$31.230

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 822 parts In-Stock

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$31.230

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822

$31.230

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Mouser Electronics

USA . 450 parts In-Stock

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$39.210

100+ parts

$28.790

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450

$39.210

$28.790

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DigiKey

USA . 1,576 parts In-Stock

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$41.070

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$29.488

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1,576

$41.070

$29.488

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Rochester

USA . 2,070 parts In-Stock

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$24.500

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$21.920

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$20.630

2,070

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$24.500

$21.920

$20.630

Verical

USA . 2,070 parts In-Stock

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$30.625

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$27.400

10k+ parts

$25.788

2,070

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$30.625

$27.400

$25.788

Flip Electronics (Authorized)

USA . 65 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,777 parts In-Stock

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$21.907

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$21.907

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Chip Stock

USA . 7,800 parts In-Stock

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Anansix

USA . 2,165 parts In-Stock

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Vyrian

USA . 629 parts In-Stock

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North Shore Components

USA . 500 parts In-Stock

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500

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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Flip Electronics

USA . 65 parts In-Stock

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65

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DigiKey Marketplace

USA . 53 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 11 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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EMSNET

USA . 3 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$19.246

100+ parts

$17.514

1k+ parts

$15.782

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750

$19.246

$17.514

$15.782

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Ampacity Inc.

Singapore . 1,059 parts In-Stock

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$19.600

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1,059

$19.600

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Semicontronic

India . 617 parts In-Stock

1+ parts

$19.600

100+ parts

$19.110

1k+ parts

$19.012

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617

$19.600

$19.110

$19.012

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Corphita

USA . 1,630 parts In-Stock

1+ parts

$20.754

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1,630

$20.754

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Continental Prestige Electronics

USA . 425 parts In-Stock

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$21.820

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425

$21.820

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Component Stockers USA

USA . 2,898 parts In-Stock

1+ parts

$23.510

100+ parts

$22.100

1k+ parts

$19.980

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2,898

$23.510

$22.100

$19.980

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Aztec Data Supply Inc.

USA . 265 parts In-Stock

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$29.465

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265

$29.465

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Microchip USA

USA . 2,845 parts In-Stock

1+ parts

$51.430

100+ parts

$50.530

1k+ parts

$50.090

10k+ parts

$49.640

2,845

$51.430

$50.530

$50.090

$49.640

Corohmni

South Africa . 2,693 parts In-Stock

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$59.746

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$59.746

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UNI Independent Distributors

Spain . 5,720 parts In-Stock

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Kepictronics

USA . 4,400 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Argo Parts USA

USA . 210 parts In-Stock

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210

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Perfect Parts

USA . 62 parts In-Stock

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Overview

Enhance your electronic designs with the MCIMX351AJQ5C from NXP Semiconductors. As a trusted manufacturer in the industry, NXP delivers quality products that meet high standards for performance and reliability. This versatile IC falls under the category of Other Function uPs,uCs & Peripheral ICs, making it suitable for a wide range of applications. With features like a low profile package body and industrial temperature grade, this product offers exceptional value to customers looking for innovative solutions. Experience the benefits of cutting-edge technology with the MCIMX351AJQ5C and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and offering efficient assembly.

Maximum Supply Voltage: 1.47 V

Provides a safe operating range for the product, preventing potential damage from high voltages.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

Easier to handle and align during installation compared to irregular shapes.

No. of Terminals: 400

Offers a high level of connectivity and functionality for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact design with high density layout, ideal for space-constrained applications.

Minimum Supply Voltage: 1.33 V

Allows for operation at lower voltages, potentially reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high temperature conditions.

Minimum Operating Temperature: -40 °C

Can withstand extremely cold temperatures, making it suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

Facilitates easy integration with other components on the PCB.

Maximum Seated Height: 1.6 mm

Low profile design allows for compact and slim product form factor.

Width: 17 mm

Compact size for space-efficient installation on PCBs.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering process without damage.

Length: 17 mm

Compact size for space-efficient installation on PCBs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

Offers multiple functions in a single device, providing versatility and flexibility for different applications.

Technology: CMOS

Provides low power consumption and high noise immunity, suitable for a wide range of applications.

Terminal Form: BALL

Allows for easy soldering onto the PCB, ensuring reliable connections.

Terminal Pitch: 0.8 mm

Fine pitch design enables high density layout and compact size on the PCB.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate exposure to moisture during storage and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX351AJQ5C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.33 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCIMX351AJQ5C Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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