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MCIMX6Q6AVT10ADR

NXP Semiconductors

MCIMX6Q6AVT10ADR by NXP Semiconductors

MCIMX6Q6AVT10ADR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With 624 terminals in a GRID ARRAY package style, it has a low supply voltage range of 1.35-1.5 V for power efficiency.

Median Price

$123.000

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Arrow

USA . 313 parts In-Stock

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$123.000

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$117.140

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$115.170

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Verical

USA . 313 parts In-Stock

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$123.000

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Chip1Stop

Japan . 13 parts In-Stock

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Nova Conductors

Japan . 95 parts In-Stock

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Digiode

USA . 2,523 parts In-Stock

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Flip Electronics

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Vyrian

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Chip Stock

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Anansix

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AZTECH Wire

Italy . 480 parts In-Stock

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$7.056

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$26.747

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$25.410

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Aztec Data Supply Inc.

USA . 3,812 parts In-Stock

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Corohmni

South Africa . 1,002 parts In-Stock

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Continental Prestige Electronics

USA . 4,661 parts In-Stock

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Ampacity Inc.

Singapore . 50 parts In-Stock

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$105.480

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Modulus Dynamics

Lithuania . 23 parts In-Stock

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$111.343

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$110.229

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$106.889

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Corphita

USA . 1,085 parts In-Stock

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Microchip USA

USA . 2,694 parts In-Stock

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$139.760

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Semicontronic

India . 135 parts In-Stock

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$229.590

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$223.850

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Lixinc

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Argo Parts USA

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Perfect Parts

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Lucentia Tech

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Authorized Procurement Solutions

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Overview

Unleash the power of innovation with the MCIMX6Q6AVT10ADR by NXP Semiconductors. This cutting-edge product in the category of Other Function uPs, uCs & Peripheral ICs offers unparalleled quality and reliability. With a temperature grade suitable for automotive use and advanced CMOS technology, this system on chip delivers exceptional performance in a compact package. Seamlessly integrating into various applications, this device provides customers with unmatched value, efficiency, and versatility. Elevate your projects to new heights with the MCIMX6Q6AVT10ADR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making it suitable for various applications.

Surface Mount: YES

Allows for easy assembly onto printed circuit boards, saving time and labor costs during manufacturing.

Maximum Supply Voltage: 1.5 V

Low power consumption and efficient use of energy, making it suitable for portable devices or applications with power constraints.

Package Shape: SQUARE

Square shape allows for efficient use of space on PCBs, maximizing the functionality within a compact footprint.

No. of Terminals: 624

Provides ample connectivity options for interfacing with other components or peripherals, offering flexibility in design.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array package style offers high density and reliability, crucial for complex electronic systems.

Minimum Supply Voltage: 1.35 V

Operates at low voltage levels, reducing power consumption and heat dissipation, ideal for energy-efficient designs.

Maximum Operating Temperature: 125 °C

Capable of withstanding high operating temperatures, suitable for industrial or automotive environments with harsh conditions.

Minimum Operating Temperature: -40 °C

Functions reliably in extreme cold temperatures, making it suitable for outdoor or automotive applications in cold climates.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy placement and soldering during assembly, enhancing manufacturing efficiency.

Maximum Seated Height: 2.16 mm

Low profile design saves space and allows for compact device integration, ideal for slim and sleek electronic products.

Width: 21 mm

Standard width dimension for easy integration into various electronic designs, offering compatibility and versatility.

Maximum Time At Peak Reflow Temperature (s): 40

Short reflow time reduces thermal stress on components during assembly, ensuring product reliability and longevity.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for soldering processes, ensuring secure and robust connections for long-term performance.

Length: 21 mm

Compact length dimension allows for space-saving layouts on PCBs, enabling efficient use of board real estate.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards and requirements, ensuring reliable performance in automotive electronics applications.

Peripheral IC Type: SYSTEM ON CHIP

Integration of various peripheral functions into a single chip simplifies design complexity, reduces component count, and enhances system efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for energy-efficient and high-performance applications.

Terminal Form: BALL

Ball terminal form provides reliable connections and easy soldering points for robust and secure electrical connections.

Terminal Pitch: 0.8 mm

Fine pitch terminal spacing allows for high density packaging and compact designs, essential for miniaturization in modern electronics.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling to maintain component reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Q6AVT10ADR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

JESD-30 Code:

S-PBGA-B624

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6Q6AVT10ADR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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