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MCIMX6X1AVK08AB

NXP Semiconductors

MCIMX6X1AVK08AB by NXP Semiconductors

MCIMX6X1AVK08AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.275V to 1.5V, making it ideal for automotive applications requiring low profile, fine pitch ICs.

Median Price

$32.734

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 4,118 parts In-Stock

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Verical

USA . 4,000 parts In-Stock

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$36.148

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$36.148

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DigiKey

USA . 116 parts In-Stock

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116

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Rochester

USA . 116 parts In-Stock

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$29.320

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$26.230

10k+ parts

$24.690

116

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$29.320

$26.230

$24.690

Distributors (In-Stock)

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Digiode

USA . 455 parts In-Stock

1+ parts

$25.792

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455

$25.792

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Nova Conductors

Japan . 500 parts In-Stock

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$32.682

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500

$32.682

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Flip Electronics

USA . 4,118 parts In-Stock

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Vyrian

USA . 2,654 parts In-Stock

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Anansix

USA . 1,585 parts In-Stock

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DigiKey Marketplace

USA . 116 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,776 parts In-Stock

1+ parts

$22.160

100+ parts

$21.606

1k+ parts

$21.495

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$22.160

$21.606

$21.495

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Ampacity Inc.

Singapore . 2,653 parts In-Stock

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$22.160

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One Stop Electronics

USA . 2,642 parts In-Stock

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$22.160

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Corphita

USA . 2,028 parts In-Stock

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$24.435

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$24.435

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Corohmni

South Africa . 1,151 parts In-Stock

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$29.516

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Continental Prestige Electronics

USA . 4,430 parts In-Stock

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$32.682

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$32.028

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$32.682

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$32.028

Netroflash

USA . 2,000 parts In-Stock

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$32.682

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$32.682

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$38.936

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$36.989

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$36.989

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$38.936

$36.989

$36.989

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Aztec Data Supply Inc.

USA . 4,383 parts In-Stock

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$50.874

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$50.874

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QUARKTWIN TECHNOLOGY LTD

USA . 25,045 parts In-Stock

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Microchip USA

USA . 10,134 parts In-Stock

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UNI Independent Distributors

Spain . 8,305 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,873 parts In-Stock

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iodParts Technologies Inc.

India . 5,200 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 789 parts In-Stock

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Overview

Experience the seamless performance and reliability of the MCIMX6X1AVK08AB by NXP Semiconductors, a leading manufacturer in the industry. This cutting-edge system on chip offers endless possibilities in various applications within the Other Function uPs, uCs & Peripheral ICs category. With its superior quality and advanced technology, this product provides unparalleled value and benefits to customers, ensuring optimal functionality and efficiency for all your electronic design needs. Step into the future with NXP Semiconductors and elevate your projects to new heights with the MCIMX6X1AVK08AB.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy and efficient assembly onto PCBs.

Maximum Supply Voltage:

1.5 V - Supports low power consumption applications.

Package Shape:

SQUARE - Offers a compact and space-saving design.

No. of Terminals:

400 - Provides versatility for various connections and functions.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - Enables high-density mounting and enhanced electrical performance.

Minimum Supply Voltage:

1.275 V - Allows for operation in low voltage conditions.

Maximum Operating Temperature:

125 °C - Ensures reliable performance in high-temperature environments.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme cold conditions.

Terminal Finish:

TIN SILVER COPPER - Enhances electrical conductivity and corrosion resistance.

Terminal Position:

BOTTOM - Facilitates easy PCB layout and component placement.

Maximum Seated Height:

1.3 mm - Contributes to a slim and compact overall design.

Width:

14 mm - Fits well within standard PCB dimensions.

Maximum Time At Peak Reflow Temperature (s):

40 - Ensures safe and efficient soldering during assembly.

Peak Reflow Temperature °C:

260 - Allows for high-temperature solder reflow processes.

Length:

14 mm - Offers a balanced form factor for various applications.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive electronics applications.

Peripheral IC Type:

SYSTEM ON CHIP - Integrates multiple functions into a single IC, reducing component count and board space.

Technology:

CMOS - Provides low power consumption and high noise immunity.

Terminal Form:

BALL - Enhances solder joint reliability and ease of inspection.

Nominal Supply Voltage:

1.8 V - Offers compatibility with standard voltage levels.

Terminal Pitch:

0.65 mm - Supports fine pitch connections for high-density layouts.

Moisture Sensitivity Level (MSL):

3 - Indicates a moderate level of sensitivity to moisture during storage and assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6X1AVK08AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX6X1AVK08AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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