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MCIMX283CVM4BR2

NXP Semiconductors

MCIMX283CVM4BR2 by NXP Semiconductors

MCIMX283CVM4BR2 by NXP Semiconductors is a System on Chip with 289 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.35-1.8V and peak reflow temperature of 260°C. Ideal for industrial applications requiring low profile, fine pitch packages in a grid array style.

Median Price

$27.120

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 425 parts In-Stock

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$19.294

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Digiode

USA . 208 parts In-Stock

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Anansix

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Nova Conductors

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Bristol Electronics

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Corphita

USA . 4,140 parts In-Stock

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One Stop Electronics

USA . 475 parts In-Stock

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Semicontronic

India . 279 parts In-Stock

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$18.750

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$18.281

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$18.188

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Ampacity Inc.

Singapore . 274 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Microchip USA

USA . 3,801 parts In-Stock

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Corohmni

South Africa . 54 parts In-Stock

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Aztec Data Supply Inc.

USA . 856 parts In-Stock

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Argo Parts USA

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Perfect Parts

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UNI Independent Distributors

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Overview

Discover the unparalleled quality and innovation of NXP Semiconductors with the MCIMX283CVM4BR2. This cutting-edge System on Chip offers a wide range of applications in the category of Other Function uPs, uCs & Peripheral ICs, providing customers with unmatched performance and reliability. With a maximum supply voltage of 1.55V and a temperature grade of Industrial, this product delivers exceptional value and benefits to users looking for top-notch technology solutions. Trust NXP Semiconductors to elevate your projects to the next level with the MCIMX283CVM4BR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.55 V

The maximum supply voltage of 1.55V ensures safe operation and protects the product from voltage spikes.

Package Shape: SQUARE

The square package shape offers a compact design, making it easy to integrate into different electronic devices.

Power Supplies (V): 1.4,1.8

Support for multiple power supply voltages allows for flexibility in design and compatibility with different power sources.

No. of Terminals: 289

The high number of terminals enables connectivity to various external components, expanding the product's functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances heat dissipation, reduces signal interference, and optimizes PCB layout.

Minimum Supply Voltage: 1.35 V

The minimum supply voltage of 1.35V ensures efficient power consumption and extends the product's battery life.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper ensures good conductivity and corrosion resistance, enhancing the product's lifespan.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process and improves signal integrity in the circuit.

Maximum Seated Height: 1.37 mm

The low maximum seated height of 1.37mm saves space in the overall system design and allows for compact device configurations.

Width: 14 mm

The 14mm width provides a balance between compactness and ease of handling during installation.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and prevents damage to the product during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable solder joints and meets industry standards for lead-free soldering processes.

Length: 14 mm

The 14mm length provides a symmetrical design, facilitating uniform heat dissipation and signal transmission throughout the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates various functions into a single chip, reducing component count, power consumption, and overall system cost.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making the product efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections, high thermal conductivity, and easy reworkability during assembly.

Nominal Supply Voltage: 1.45 V

The nominal supply voltage of 1.45V ensures stable operation and compatibility with standard power sources, enhancing the product's reliability.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm allows for high-density mounting, enabling more functionality in a compact design and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product is suitable for a wide range of storage and handling conditions, ensuring long-term reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX283CVM4BR2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.37 mm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX283CVM4BR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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