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MSP430F6779IPEU

Texas Instruments

MSP430F6779IPEU by Texas Instruments

MSP430F6779IPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at a max frequency of 25 MHz. Ideal for industrial applications, it features ROM of 524288 words and RAM of 32 words. With a supply voltage range of 1.8-3.6 V, this CMOS technology-based IC supports I2C, SPI, and UART bus compatibility.

Median Price

$17.758

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,615 parts In-Stock

1+ parts

$12.976

100+ parts

$11.335

1k+ parts

$7.817

10k+ parts

-

5,615

$12.976

$11.335

$7.817

-

Mouser Electronics

USA . 93 parts In-Stock

1+ parts

$22.540

100+ parts

$13.750

1k+ parts

$13.630

10k+ parts

-

93

$22.540

$13.750

$13.630

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,902 parts In-Stock

1+ parts

$12.327

100+ parts

-

1k+ parts

-

10k+ parts

-

3,902

$12.327

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$13.590

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$13.590

-

-

-

Vyrian

USA . 7,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,910

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,665 parts In-Stock

1+ parts

$11.030

100+ parts

$10.754

1k+ parts

$10.699

10k+ parts

-

2,665

$11.030

$10.754

$10.699

-

Ampacity Inc.

Singapore . 2,568 parts In-Stock

1+ parts

$11.030

100+ parts

-

1k+ parts

-

10k+ parts

-

2,568

$11.030

-

-

-

Corphita

USA . 1,394 parts In-Stock

1+ parts

$11.678

100+ parts

-

1k+ parts

-

10k+ parts

-

1,394

$11.678

-

-

-

Continental Prestige Electronics

USA . 292 parts In-Stock

1+ parts

$13.590

100+ parts

-

1k+ parts

-

10k+ parts

$13.318

292

$13.590

-

-

$13.318

Netroflash

USA . 100 parts In-Stock

1+ parts

$13.590

100+ parts

-

1k+ parts

$12.911

10k+ parts

$12.639

100

$13.590

-

$12.911

$12.639

Corohmni

South Africa . 5,045 parts In-Stock

1+ parts

$15.280

100+ parts

-

1k+ parts

-

10k+ parts

-

5,045

$15.280

-

-

-

Parana Technologies

USA . 2,363 parts In-Stock

1+ parts

$32.873

100+ parts

-

1k+ parts

$113.905

10k+ parts

-

2,363

$32.873

-

$113.905

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DigiPath Technology Company

USA . 1,401 parts In-Stock

1+ parts

$36.197

100+ parts

$33.301

1k+ parts

-

10k+ parts

-

1,401

$36.197

$33.301

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-

IDEA Electronic Components Group

UK . 96 parts In-Stock

1+ parts

$36.936

100+ parts

$35.089

1k+ parts

$33.242

10k+ parts

-

96

$36.936

$35.089

$33.242

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ChromeModa Solutions

Germany . 33 parts In-Stock

1+ parts

$36.936

100+ parts

$30.288

1k+ parts

-

10k+ parts

-

33

$36.936

$30.288

-

-

Argo Parts USA

USA . 3,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,855

-

-

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Overview

Unleash the power of innovation with Texas Instruments' MSP430F6779IPEU, a cutting-edge microprocessor circuit that is revolutionizing the industry. Designed with precision and quality in mind, this device offers unmatched performance and reliability for a wide range of applications. From IoT devices to consumer electronics, the MSP430F6779IPEU delivers exceptional value and benefits to customers seeking top-notch solutions. Embrace the future of technology with this advanced IC and experience the advantages of Texas Instruments' expertise in semiconductor manufacturing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuit, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Provides versatility in power supply options, allowing for compatibility with a range of systems.

Minimum Supply Voltage: 1.8 V

Offers energy-efficient operation and flexibility in power management.

CPU Family: MSP430

Utilizes a reputable and established CPU family known for its reliability and performance.

Maximum Clock Frequency: 25 MHz

Enables high-speed processing and efficient operation for various applications.

RAM Bytes: 32768

Provides ample memory capacity for storing and accessing data quickly and efficiently.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates advanced peripheral functions for enhanced device capabilities and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6779IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6779IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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