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MSP430F67641AIPNR

Texas Instruments

MSP430F67641AIPNR by Texas Instruments

MSP430F67641AIPNR by Texas Instruments is a 80-terminal microprocessor circuit with 8192 bytes of RAM. Operating at temperatures from -40 to 85°C, it supports I2C, SPI, and UART bus compatibility. This CMOS technology device has a low profile package style suitable for industrial applications.

Median Price

$4.674

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,379 parts In-Stock

1+ parts

$4.674

100+ parts

$3.810

1k+ parts

$2.540

10k+ parts

-

6,379

$4.674

$3.810

$2.540

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.713

100+ parts

-

1k+ parts

-

10k+ parts

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150

$3.713

-

-

-

Digiode

USA . 3,175 parts In-Stock

1+ parts

$4.440

100+ parts

-

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-

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3,175

$4.440

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-

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Vyrian

USA . 7,701 parts In-Stock

1+ parts

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7,701

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,501 parts In-Stock

1+ parts

$3.713

100+ parts

-

1k+ parts

-

10k+ parts

$3.638

2,501

$3.713

-

-

$3.638

Argo Parts USA

USA . 2,365 parts In-Stock

1+ parts

$3.713

100+ parts

-

1k+ parts

-

10k+ parts

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2,365

$3.713

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-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$3.713

100+ parts

-

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100

$3.713

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-

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Ampacity Inc.

Singapore . 5,896 parts In-Stock

1+ parts

$3.970

100+ parts

-

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5,896

$3.970

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Corphita

USA . 706 parts In-Stock

1+ parts

$4.207

100+ parts

-

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706

$4.207

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-

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AZTECH Wire

Italy . 1,116 parts In-Stock

1+ parts

$8.630

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1,116

$8.630

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Microchip USA

USA . 1,573 parts In-Stock

1+ parts

$22.510

100+ parts

$22.370

1k+ parts

$22.300

10k+ parts

$22.230

1,573

$22.510

$22.370

$22.300

$22.230

Parana Technologies

USA . 2,134 parts In-Stock

1+ parts

$23.913

100+ parts

-

1k+ parts

$24.552

10k+ parts

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2,134

$23.913

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$24.552

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DigiPath Technology Company

USA . 1,601 parts In-Stock

1+ parts

$26.331

100+ parts

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1k+ parts

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10k+ parts

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1,601

$26.331

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ChromeModa Solutions

Germany . 1,760 parts In-Stock

1+ parts

$26.868

100+ parts

$22.032

1k+ parts

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1,760

$26.868

$22.032

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IDEA Electronic Components Group

UK . 625 parts In-Stock

1+ parts

$26.868

100+ parts

$25.525

1k+ parts

$24.181

10k+ parts

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625

$26.868

$25.525

$24.181

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Corohmni

South Africa . 2,580 parts In-Stock

1+ parts

$63.827

100+ parts

-

1k+ parts

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10k+ parts

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2,580

$63.827

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F67641AIPNR microprocessor circuit. Designed for industrial applications, this high-quality product offers unmatched performance and reliability. With a wide range of features including ADC channels, low power consumption, and compatibility with I2C, SPI, and UART buses, this device is perfect for a variety of functions within the electronics industry. Trust in Texas Instruments' reputation for excellence and choose the MSP430F67641AIPNR for all your microprocessor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB layout, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

This high supply voltage provides versatility and compatibility with various power sources, increasing the product's usability.

Package Shape: SQUARE

The square shape allows for easy integration into existing systems and circuits, enhancing flexibility in design options.

No. of Terminals: 80

With a high number of terminals, this product offers connectivity for multiple external components, maximizing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style ensures efficient heat dissipation and optimal signal transmission, enhancing overall performance.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage helps conserve power and extend battery life in portable applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand harsh environmental conditions, ensuring reliability in various settings.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making the product an energy-efficient choice.

Minimum Operating Temperature: -40 °C

The product's ability to operate at extremely low temperatures makes it ideal for industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent corrosion resistance and ensures reliable connections, increasing the product's durability.

ADC Channels: YES

The presence of ADC channels enables the product to accurately convert analog signals to digital data, enhancing its versatility in signal processing applications.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and secure attachment to the PCB, simplifying the assembly process.

Maximum Seated Height: 1.6 mm

The low seated height of the package saves vertical space on the PCB, enabling compact and streamlined designs.

RAM Words: 8

The 8 RAM words provide sufficient memory for temporary data storage, facilitating smooth operation and efficient data processing.

Width: 12 mm

The narrow width of the package conserves PCB real estate, enabling designers to create compact and space-efficient electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time helps minimize thermal stress on components during soldering, ensuring reliable performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure solder joints and excellent thermal stability, enhancing the product's reliability.

Length: 12 mm

The compact length of the package lends itself well to space-constrained applications, providing flexibility in design options.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh environments with wide temperature fluctuations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

This peripheral IC type integrates essential microprocessor functions, enhancing the product's overall performance and functionality.

RAM Bytes: 8192

The large RAM capacity of 8192 bytes allows for efficient data storage and processing, supporting complex applications and algorithms.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder joints and ease of inspection, ensuring reliable connections and assembly.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is commonly used in electronics, offering compatibility with standard power sources and components.

Bus Compatibility: I2C; SPI; UART

The product's compatibility with multiple bus interfaces, such as I2C, SPI, and UART, enhances connectivity options and interoperability with other devices.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting, enabling compact PCB designs with increased functionality.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product can withstand moderate exposure to moisture during storage and assembly, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67641AIPNR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

8

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MSP430F67641AIPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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