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MSP430F6779IPZ

Texas Instruments

MSP430F6779IPZ by Texas Instruments

MSP430F6779IPZ by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. Operating at up to 25 MHz, it has ADC channels, I2C/SPI/UART compatibility, and operates in industrial temperatures. Ideal for applications requiring low power consumption and high performance in compact designs.

Median Price

$21.930

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 31,428 parts In-Stock

1+ parts

$12.072

100+ parts

$10.544

1k+ parts

$7.272

10k+ parts

-

31,428

$12.072

$10.544

$7.272

-

Mouser Electronics

USA . 12 parts In-Stock

1+ parts

$21.930

100+ parts

$15.300

1k+ parts

$14.250

10k+ parts

-

12

$21.930

$15.300

$14.250

-

DigiKey

USA . 6 parts In-Stock

1+ parts

$21.930

100+ parts

$15.304

1k+ parts

$14.354

10k+ parts

-

6

$21.930

$15.304

$14.354

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,773 parts In-Stock

1+ parts

$11.468

100+ parts

-

1k+ parts

-

10k+ parts

-

2,773

$11.468

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$12.653

100+ parts

-

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-

10k+ parts

-

150

$12.653

-

-

-

Vyrian

USA . 8,526 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,526

-

-

-

-

Chip Stock

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,500

-

-

-

-

LWI Electronics Inc

India . 8 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 10,461 parts In-Stock

1+ parts

$10.260

100+ parts

$10.004

1k+ parts

$9.952

10k+ parts

-

10,461

$10.260

$10.004

$9.952

-

Ampacity Inc.

Singapore . 10,182 parts In-Stock

1+ parts

$10.260

100+ parts

-

1k+ parts

-

10k+ parts

-

10,182

$10.260

-

-

-

Corphita

USA . 965 parts In-Stock

1+ parts

$10.865

100+ parts

-

1k+ parts

-

10k+ parts

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965

$10.865

-

-

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Corohmni

South Africa . 2,372 parts In-Stock

1+ parts

$11.635

100+ parts

-

1k+ parts

-

10k+ parts

-

2,372

$11.635

-

-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$12.400

100+ parts

-

1k+ parts

$11.904

10k+ parts

-

500

$12.400

-

$11.904

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Continental Prestige Electronics

USA . 2,586 parts In-Stock

1+ parts

$12.653

100+ parts

-

1k+ parts

-

10k+ parts

$12.400

2,586

$12.653

-

-

$12.400

Parana Technologies

USA . 897 parts In-Stock

1+ parts

$23.791

100+ parts

-

1k+ parts

$24.423

10k+ parts

-

897

$23.791

-

$24.423

-

DigiPath Technology Company

USA . 615 parts In-Stock

1+ parts

$26.196

100+ parts

$24.101

1k+ parts

-

10k+ parts

-

615

$26.196

$24.101

-

-

ChromeModa Solutions

Germany . 2,452 parts In-Stock

1+ parts

$26.731

100+ parts

$21.919

1k+ parts

-

10k+ parts

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2,452

$26.731

$21.919

-

-

IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$26.731

100+ parts

$25.394

1k+ parts

$24.058

10k+ parts

-

743

$26.731

$25.394

$24.058

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$41.556

100+ parts

$37.816

1k+ parts

$34.076

10k+ parts

-

5,000

$41.556

$37.816

$34.076

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Microchip USA

USA . 2,665 parts In-Stock

1+ parts

$43.180

100+ parts

$42.560

1k+ parts

$42.250

10k+ parts

$41.940

2,665

$43.180

$42.560

$42.250

$41.940

Argo Parts USA

USA . 3,333 parts In-Stock

1+ parts

-

100+ parts

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3,333

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Perfect Parts

USA . 386 parts In-Stock

1+ parts

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386

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Robosynatics

Brazil . 150 parts In-Stock

1+ parts

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150

-

-

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Lucentia Tech

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$3.877

1k+ parts

$3.877

10k+ parts

$3.877

150

-

$3.877

$3.877

$3.877

Overview

Unlock endless possibilities with the MSP430F6779IPZ by Texas Instruments. Designed with precision and reliability in mind, this innovative microprocessor circuit offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, the MSP430 series delivers top-notch quality and efficiency. Experience seamless integration, high-speed processing, and low power consumption all in one compact package. Elevate your projects to new heights with the MSP430F6779IPZ - where cutting-edge technology meets exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a PCB.

Maximum Supply Voltage: 3.6 V

Can operate at a relatively high supply voltage for better performance under various conditions.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space and easy integration into circuit designs.

Bit Size: 16

Features a 16-bit architecture for enhanced processing capabilities.

Power Supplies (V): 2/3.3

Compatible with multiple power supply voltages for flexibility in different applications.

No. of Terminals: 100

Sufficient number of terminals for connecting to various components and peripherals.

Minimum Supply Voltage: 1.8 V

Can operate at a low minimum supply voltage for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures for industrial applications.

CPU Family: MSP430

Utilizes the efficient and low-power MSP430 CPU family for reliable performance.

ADC Channels: YES

Includes Analog-to-Digital Converter channels for converting analog signals to digital data.

ROM Words: 524288

Large ROM size for storing program instructions and data.

RAM Words: 32

Adequate RAM size for data storage and manipulation during operation.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast processing speeds.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides durable and reliable terminal finish for long-term use.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit enhances the product's functionality and processing capabilities.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6779IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6779IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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