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XCZU4CG-1FBVB900E

Xilinx

XCZU4CG-1FBVB900E by Xilinx

XCZU4CG-1FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. With a supply voltage range of 0.825-0.876 V, it's ideal for applications requiring high-performance processing capabilities in various electronic devices.

Median Price

$1,512.940

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Newark

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Mouser Electronics

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DigiKey

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Farnell

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Element14

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Digiode

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Nova Conductors

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Vyrian

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Cyclops Electronics Ltd

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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Aztec Data Supply Inc.

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Modulus Dynamics

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Kenton Components

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Qasali Group International

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Netroflash

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Overview

Unleash the power of innovation with the XCZU4CG-1FBVB900E by Xilinx, a cutting-edge microprocessor circuit designed for peak performance. With Xilinx's renowned reputation for quality and reliability, this product offers unmatched value and benefits for a wide range of applications. From advanced computing systems to intricate electronic devices, the XCZU4CG-1FBVB900E delivers exceptional functionality and efficiency. Upgrade your projects with this versatile solution and experience the advantages of Xilinx technology firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for various applications.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly of the product onto circuit boards, saving space and improving overall performance.

Maximum Supply Voltage: 0.876 V

The higher maximum supply voltage allows for flexibility in power requirements and potential for enhanced performance.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor that is easy to integrate into existing designs and systems.

No. of Terminals: 900

Having a large number of terminals allows for increased connectivity options and versatility in connecting to other components.

Package Style (Meter): GRID ARRAY

The grid array package style offers excellent thermal performance and high reliability, ensuring stable operation in various conditions.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature indicates that the product can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function effectively even in colder environments.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy installation and maintenance of the product on circuit boards.

Peak Reflow Temperature: 245C

The high peak reflow temperature allows for reliable soldering and assembly processes, ensuring long-term durability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality, making it suitable for complex tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, improving overall efficiency.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection, ensuring stable electrical performance and durability.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage is well-suited for efficient power consumption and compatibility with various voltage levels in a system.

Moisture Sensitivity Level (MSL): 4

The MSL rating indicates the product's resistance to moisture, ensuring long-term reliability and performance in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4CG-1FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4CG-1FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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