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XC7Z010-L1CLG225I

Xilinx

XC7Z010-L1CLG225I by Xilinx

XC7Z010-L1CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package features a grid array style with 225 terminals and is ideal for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

Median Price

$101.200

Lifecycle Status

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1k+

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Mouser Electronics

USA . 4 parts In-Stock

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Digiode

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France . 709 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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AZTECH Wire

Italy . 708 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 999 parts In-Stock

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Vigor

Singapore . 727 parts In-Stock

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Ampacity Inc.

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Corphita

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Modulus Dynamics

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Netroflash

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Texas Native Microelectronics

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Microchip USA

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Qasali Group International

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Overview

Revolutionize your next project with the XC7Z010-L1CLG225I by Xilinx, a cutting-edge SYSTEM ON CHIP that offers unparalleled performance and reliability. With Xilinx's reputation for excellence in technology innovation, this versatile device is ideal for a wide range of applications in the field of Other Function uPs,uCs & Peripheral ICs. Experience seamless integration, superior quality, and unmatched value with the XC7Z010-L1CLG225I, making it the perfect choice for your next design challenge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient installation on a PCB.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for versatile compatibility with different power sources.

Package Shape: SQUARE

The square package shape makes it easy to align and place multiple units on a board for compact designs.

No. of Terminals: 225

Having a high number of terminals allows for connecting to various components and interfaces, adding flexibility to the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high performance and density in a compact form factor.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows the product to perform reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme cold environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy integration and soldering onto a PCB.

Maximum Seated Height: 1.5 mm

The low profile design with a maximum seated height of 1.5 mm enables compact and slim device designs.

Width: 13 mm

The 13mm width provides a good balance between space-saving and ease of handling during assembly.

Length: 13 mm

The 13mm length complements the square package shape, making it suitable for densely populated PCBs.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip architecture integrates multiple functions into a single chip, reducing component count and simplifying design.

Technology: CMOS

The CMOS technology enables low power consumption and high speed operation, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures reliable electrical connections and is suitable for fine pitch applications.

Nominal Supply Voltage: 1 V

The 1V nominal supply voltage is a standard value that allows for compatibility with typical power sources.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch provides fine spacing for high-density mounting on a PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z010-L1CLG225I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B225

Length:

13 mm

No. of Terminals:

225

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA225,15X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XC7Z010-L1CLG225I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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