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XC7Z020-2CLG400I

Xilinx

XC7Z020-2CLG400I by Xilinx

XC7Z020-2CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low-profile, fine-pitch grid arrays in plastic/epoxy packages.

Median Price

$173.750

Lifecycle Status

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Farnell

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Mouser Electronics

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Newark

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Element14

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Digiode

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VNN

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Bristol Electronics

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IBS Electronics

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Nova Conductors

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Carlin Systems, Inc.

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Modulus Dynamics

Lithuania . 758 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

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Texas Native Microelectronics

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Semicontronic

India . 368 parts In-Stock

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Ampacity Inc.

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Continental Prestige Electronics

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Corphita

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Vigor

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Advanced Electronics

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Lixinc

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Qasali Group International

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iodParts Technologies Inc.

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Netroflash

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Kenton Components

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MARBEL Systems

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Speed Components Ltd (Excess)

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Overview

Elevate your projects to new heights with the XC7Z020-2CLG400I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-notch quality and reliability. This versatile System on Chip is perfect for a wide range of applications, offering cutting-edge technology and performance. With its low profile package and fine pitch design, this product provides exceptional value, benefits, and advantages to customers looking to take their designs to the next level. Experience the difference with Xilinx today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and improving overall reliability.

Maximum Supply Voltage: 1.05 V

Provides flexibility in power supply options while ensuring the product operates within safe voltage limits.

Package Shape: SQUARE

Optimal shape for efficient use of space on a PCB.

No. of Terminals: 400

Offers a high level of connectivity for various input and output options.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables precise and reliable connections with other components on the PCB.

Minimum Supply Voltage: 0.95 V

Allows for operation at lower voltages, saving power and reducing heat dissipation.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures, making it suitable for a variety of operating environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, increasing the product's versatility.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Provides corrosion resistance and reliable electrical connections.

Terminal Position: BOTTOM

Simplifies the manufacturing and assembly process of the product.

Maximum Seated Height: 1.6 mm

Low profile design allows for compact and space-saving PCB layouts.

Width: 17 mm

Compact width dimension facilitates integration into various system designs.

Length: 17 mm

Compact length dimension facilitates integration into various system designs.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions into a single chip simplifies system design and reduces component count.

Technology: CMOS

Uses low power consumption CMOS technology for efficient operation.

Terminal Form: BALL

Ball terminals provide reliable and high-speed connections.

Nominal Supply Voltage: 1 V

Stable and standardized supply voltage for consistent performance.

Terminal Pitch: 0.8 mm

Compact terminal pitch allows for high density mounting on a PCB.

Moisture Sensitivity Level (MSL): 3

Describes the product's sensitivity to moisture during storage and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z020-2CLG400I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z020-2CLG400I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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