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XC7Z010-1CLG225I

Xilinx

XC7Z010-1CLG225I by Xilinx

The Xilinx XC7Z010-1CLG225I is a low-profile, fine-pitch grid array IC with 225 terminals. Operating b/w -40 to 100°C, it features a CMOS technology and requires a supply voltage of 0.95V to 1.05V. Ideal for System on Chip applications due to its compact size and ball terminal form factor.

Median Price

$92.185

Lifecycle Status

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Mouser Electronics

USA . 10 parts In-Stock

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$89.660

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DigiKey

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Digiode

USA . 254 parts In-Stock

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Nova Conductors

Japan . 82 parts In-Stock

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VNN

France . 188 parts In-Stock

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Vyrian

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Modulus Dynamics

Lithuania . 395 parts In-Stock

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$13.014

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AZTECH Wire

Italy . 742 parts In-Stock

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Aztec Data Supply Inc.

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MARBEL Systems

Belgium . 3,243 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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$37.894

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$42.896

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$40.752

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Corohmni

South Africa . 512 parts In-Stock

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Vigor

Singapore . 963 parts In-Stock

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Semicontronic

India . 434 parts In-Stock

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$73.180

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$71.350

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One Stop Electronics

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Corphita

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Qasali Group International

UK . 90 parts In-Stock

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Continental Prestige Electronics

USA . 2,555 parts In-Stock

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$86.090

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$84.368

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Netroflash

USA . 100 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 123 parts In-Stock

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Lixinc

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Supply Digital

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Argo Parts USA

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Lucentia Tech

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Perfect Parts

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Overview

Unlock unparalleled performance and efficiency with the XC7Z010-1CLG225I by Xilinx. Known for its top-notch quality and cutting-edge technology, Xilinx continues to be a leader in the industry. This versatile system on chip provides endless possibilities for a wide range of applications. From IoT devices to industrial automation, this product offers unmatched value and benefits to customers looking to elevate their projects to the next level. Experience the advantages of Xilinx and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mounting allows for easy integration onto circuit boards, saving space and making assembly more convenient.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage provides flexibility and compatibility with different power sources.

Package Shape: SQUARE

The square shape of the package allows for a compact design, saving space in electronic devices.

No. of Terminals: 225

Having a large number of terminals allows for more connectivity options and functionality in the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a reliable and efficient design for the product, contributing to its overall performance.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures efficient power consumption, making the product energy-efficient.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without malfunctioning.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the product to function effectively even in extreme cold environments.

Terminal Position: BOTTOM

Terminal positions at the bottom facilitate easier soldering and connectivity, enhancing the overall reliability of the product.

Maximum Seated Height: 1.5 mm

The low maximum seated height enables a slim design for the product, making it suitable for compact electronic devices.

Width: 13 mm

The moderate width of the product allows for easy integration into various electronic applications.

Length: 13 mm

The compact length of the product contributes to its space-saving design, making it ideal for small electronic devices.

Peripheral IC Type: SYSTEM ON CHIP

The inclusion of a system-on-chip peripheral IC ensures efficient integration of various functions into a single chip, enhancing the overall performance of the product.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminals provide secure connections and ensure reliable signal transmission within the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage offers optimal power efficiency and ensures stable operation of the product.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for densely packed terminals, enabling a high level of connectivity and functionality in the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z010-1CLG225I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B225

Length:

13 mm

No. of Terminals:

225

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA225,15X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XC7Z010-1CLG225I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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