Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NT3H2111W0FHKH by NXP Semiconductors is an 8-terminal microprocessor circuit with a supply voltage range of 1.67V to 3.6V, operating from -40°C to 105°C. It features a compact square chip carrier package suitable for industrial applications requiring low-profile components and surface mount technology.
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Provides durability and protection to the internal components of the product.
Allows for easy and efficient installation on PCBs, saving space and enhancing reliability.
Can handle high voltage input, making it versatile for various applications.
Helps in easy handling and placement during assembly.
Provides enough connectivity options for interfacing with other components.
Can operate in a wide range of temperatures, suitable for different environments.
Low profile design allows for compact and space-saving PCB layout.
Utilizes CMOS technology for low power consumption and high speed performance.
Efficient power usage at a lower voltage for energy savings.
Other Function uPs,uCs & Peripheral ICs NT3H2111W0FHKH attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
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Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
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Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
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Technology:
Temperature Grade:
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Peripheral IC Type:
NT3H2111W0FHKH Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.32.00
SB
8542.31.00.00
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Taitron Components
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2931AZ-5.0G
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
Semtech
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
Diodes Incorporated
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
FT800Q-T
FTDI
FTDI's FT800Q-T is a 48-terminal peripheral IC with a square package style. It operates b/w -40 to 85°C, with supply voltage ranging from 2.97V to 3.63V. Ideal for industrial applications requiring a CMOS microprocessor circuit in a compact chip carrier form factor.
XC7Z014S-2CLG484I
Xilinx
XC7Z014S-2CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. This package, measuring 19mm x 19mm, features a grid array style and is ideal for various applications requiring low profile, fine pitch ICs.
MPFS250T-FCG1152I
Microchip Technology
MPFS250T-FCG1152I by Microchip Tech is a 1152-terminal programmable SoC with CMOS tech. Operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density integration in compact spaces.
XC7Z015-1CLG485C
XC7Z015-1CLG485C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
XC7Z030-1FBG484I
The Xilinx XC7Z030-1FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 484 terminals, it's ideal for applications requiring high-performance processing in compact spaces.
SE051C2HQ1/Z01XDZ
NXP Semiconductors
SE051C2HQ1/Z01XDZ by NXP Semiconductors is a cryptographic authenticator IC with 20 terminals, operating voltage range of 1.62V to 3.6V, and temperature range from -40°C to 105°C. It features a square chip carrier package style suitable for surface mount applications in various electronic devices.
CC2541F256RHAR
CC2541F256RHAR by Texas Instruments is a 40-terminal microprocessor circuit with 8192 bytes of RAM. Operating at temperatures from -40 to 85°C, it supports I2C, SPI, USART, and USB bus compatibility. Ideal for industrial applications requiring low power consumption and versatile peripheral interfaces.
XC7Z030-2FBG676I
The Xilinx XC7Z030-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.
TCI6630K2LCMS
TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.
CY8C4248LQI-BL583
Infineon Technologies
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
MIMXRT1042XFP5B
SYSTEM ON CHIP;
KSZ8463RLI
Micrel
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
MIMXRT1041XJM5B
CC1310F128RHBT
CC1310F128RHBT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package.
STM32HSM-V2ML
CRYPTOGRAPHIC AUTHENTICATOR;
MCIMX6L8DVN10AA
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 432; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B432;
EFR32MG12P432F1024GM48-C
Silicon Labs
CY8C4146LQI-S422
ATMXT224S-MAUR043
ATMXT224S-MAUR043 by Microchip Technology is a 56-terminal, surface mount IC with a square package shape. It operates at a voltage range of 3V to 3.47V and has a max seated height of 0.6mm. This capacitive touch screen controller is suitable for various applications requiring precise touch input.
DA16200MOD-AAC4WA32
Renesas Electronics
SYSTEM ON CHIP; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
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NT3H2111W0FTTJ
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30;
NT3H2211W0FHKH
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
NT3H2111W0FT1X
MICROPROCESSOR CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1;
NT3H2111W0FHK
NT3H2111W0FHK by NXP Semiconductors is a surface mount microprocessor circuit with 8 terminals. It operates at a supply voltage range of 1.67V to 3.6V and can withstand temperatures from -40°C to 105°C. This chip carrier package is commonly used in industrial applications requiring NFC functionality.
NT3H2211W0FTTJ
MICROPROCESSOR CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e4;
NT3H1201W0FHKH
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: QCCN; Package Shape: SQUARE;
NT3H1101W0FHKH
NT3H1101W0FHKH by NXP Semiconductors is an 8-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 95°C, suitable for industrial applications. With a supply voltage range of 1.7V to 3.6V, it is ideal for various functions in uPs and uCs.
NT3H1101W0FHK
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: VQCCN; Package Shape: SQUARE;
NT3H2111W0FUG
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Package Shape: UNSPECIFIED; Technology: CMOS; Minimum Operating Temperature: -40 Cel; Minimum Supply Voltage: 1.67 V;
NT3H1201W0FTTJ
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): 260;
NT3H2211W0FHK
NT3H1201W0FTT
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
NT3H1101W0FTTJ
NT3H1101W0FUG
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES;
NT3H1201W0FUG
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N;
NT3H2211W0FT1
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
NT3H1201W0FHK
NT3H2111W0FT1
NT3H1101W0FTT
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