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NT3H1101W0FHK

NXP Semiconductors

NT3H1101W0FHK by NXP Semiconductors

NT3H1101W0FHK by NXP Semiconductors is an 8-terminal microprocessor circuit with a supply voltage range of 1.8V to 3.6V, operating b/w -40°C to 85°C. This square-shaped chip carrier IC, suitable for industrial applications, features a very thin profile and nickel palladium gold terminal finish for surface mount assembly.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 95,974 parts In-Stock

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J2 Sourcing AB

Sweden . 53,947 parts In-Stock

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Digiode

USA . 2,677 parts In-Stock

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Anansix

USA . 1,850 parts In-Stock

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Vyrian

USA . 1,505 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,215 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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AZTECH Wire

Italy . 891 parts In-Stock

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$19.374

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Corohmni

South Africa . 651 parts In-Stock

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$23.357

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Ampacity Inc.

Singapore . 616 parts In-Stock

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$24.000

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One Stop Electronics

USA . 850 parts In-Stock

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$30.000

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Lixinc

USA . 19,315 parts In-Stock

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UNI Independent Distributors

Spain . 7,100 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,501 parts In-Stock

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Continental Prestige Electronics

USA . 4,915 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

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Argo Parts USA

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Kepictronics

USA . 560 parts In-Stock

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Futuretech Components

Singapore . 521 parts In-Stock

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Perfect Parts

USA . 31 parts In-Stock

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Overview

Unlock the endless possibilities of connectivity with the NT3H1101W0FHK by NXP Semiconductors. This innovative product offers seamless integration into various applications within the tech industry, thanks to its cutting-edge technology and superior quality. NXP Semiconductors, a renowned manufacturer known for its reliability and innovation, has crafted this product to provide customers with unparalleled value and benefits. Elevate your projects with this versatile microprocessor circuit that boasts a wide range of advantages, making it a must-have component in your arsenal of technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy integration onto circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage requirements.

Package Shape: SQUARE

Saves space and allows for efficient arrangement on the PCB.

No. of Terminals: 8

Offers flexibility in connecting to other components.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Reduces overall size of the product for compact designs.

Minimum Supply Voltage: 1.8 V

Supports lower power consumption requirements.

Maximum Operating Temperature: 85 °C

Suitable for applications that require high temperature tolerance.

Minimum Operating Temperature: -40 °C

Can operate effectively in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides high conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Ensures proper alignment and secure installation on the PCB.

Maximum Seated Height: 0.5 mm

Helps in maintaining a low profile design.

Width: 1.6 mm

Compact size for efficient use of space on the board.

Length: 1.6 mm

Compact size for efficient use of space on the board.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications that require robust performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Offers advanced processing capabilities for demanding tasks.

Technology: CMOS

Provides low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

Lead-free construction for environmental compliance.

Terminal Pitch: 0.5 mm

Allows for close spacing of terminals for high-density mounting.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs NT3H1101W0FHK attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

1.6 mm

Peripheral IC Type:

Trade Compliance

NT3H1101W0FHK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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