Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NT3H1201W0FHKH by NXP Semiconductors is an 8-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 95°C, with a supply voltage range of 1.7V to 3.6V. Ideal for industrial applications requiring a compact chip carrier package style and surface mount compatibility.
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Provides durability and protection for the internal components of the IC, ensuring a longer lifespan for the product.
Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.
Can handle higher voltage inputs, making it suitable for a wide range of applications requiring different power levels.
Square shape helps in efficient space utilization on circuit boards, especially for compact designs.
Can operate at lower voltage levels, enabling energy-efficient performance and compatibility with lower power sources.
Can withstand high temperatures without performance degradation, making it suitable for industrial applications with varying environmental conditions.
Capable of functioning in extremely low temperatures, ensuring reliable operation in diverse operating environments.
Quad terminal position provides stable connectivity and efficient signal transmission, enhancing overall performance.
Low seated height allows for compact and slim designs, reducing space constraints on circuit boards.
Narrow width facilitates efficient board layout and component placement, enabling streamlined circuit design.
High peak reflow temperature ensures secure soldering during assembly, preventing connection issues and ensuring reliability.
Compact length enables space-saving arrangements on circuit boards, optimizing the overall design efficiency.
Industrial temperature grade ensures reliable operation in harsh environments, making it suitable for demanding industrial applications.
Incorporation of a microprocessor circuit enhances functionality and processing capabilities, enabling diverse applications and tasks.
CMOS technology offers low power consumption, high speed, and noise immunity, ensuring efficient and reliable performance.
No lead terminal form simplifies installation and maintenance, reducing the risk of connectivity issues and enhancing overall usability.
Other Function uPs,uCs & Peripheral ICs NT3H1201W0FHKH attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
JESD-30 Code:
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NT3H1201W0FHKH Peripheral ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Obsolescence/ EOL - Obsolete Notice 14/Dec/2022
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148-GS08
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Pulse Electronics
Shenzhen Socay Electronics
2N2222A
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
Sangdest Microelectronics (Nanjing)
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
DA14531-00000FX2
Renesas Electronics
SoC; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1;
TMS320DM368ZCEF
TMS320DM368ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating b/w 0-85 °C. It supports I2C, SPI, UART, USB buses and has a terminal pitch of 0.65 mm. Ideal for applications requiring low profile, fine pitch package style in CMOS technology.
CC2541F256RHAR
CC2541F256RHAR by Texas Instruments is a 40-terminal microprocessor circuit with 8192 bytes of RAM. Operating at temperatures from -40 to 85°C, it supports I2C, SPI, USART, and USB bus compatibility. Ideal for industrial applications requiring low power consumption and versatile peripheral interfaces.
XC7Z020-L1CLG484I
Xilinx
XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.
XC7Z030-2FBG676I
The Xilinx XC7Z030-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.
CC1310F32RSMR
CC1310F32RSMR by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C, with a supply voltage range of 1.8V to 3.8V. This MICROPROCESSOR CIRCUIT is ideal for industrial applications requiring low power consumption and high performance in a compact square chip carrier package.
AS5140H-ASST
Ams Ag
SYSTEM ON CHIP; Terminal Finish: TIN; JESD-609 Code: e3;
5CSXFC6D6F31I7N
Intel
SoC;
CC2541F256RHAT
CC2541F256RHAT by Texas Instruments is a 40-terminal microprocessor IC with a supply voltage range of 2-3.6V, operating temperature from -40 to 85°C, and 8192 bytes of RAM. It is ideal for industrial applications requiring I2C, SPI, USART, or USB bus compatibility and features TIMER(4) peripherals in a compact square package style.
CMX7341Q3
Cml Microcircuits
CMX7341Q3 by Cml Microcircuits is a 48-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for industrial applications, it comes in a square chip carrier package style suitable for surface mount assembly.
CC-WMX-J97C-TN
Digi International
CC-WMX-J97C-TN by Digi International is a 400-terminal microprocessor circuit with CMOS technology. It operates b/w -20°C to 70°C, in a square grid array package style measuring 50mm x 50mm. Ideal for applications requiring high-performance processing in compact spaces.
XC7Z030-1FBG676I
The Xilinx XC7Z030-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance computing and peripheral integration.
MIMX9352CVUXMAA
NXP Semiconductors
ATECC508A-MAHDA-T
Microchip Technology
Microchip ATECC508A-MAHDA-T is a cryptographic authenticator IC with 8 terminals, operating from -40 to 85°C. It supports supply voltage range of 2-5.5V and TS16949 screening level. Ideal for secure applications needing small outline, heat sink package style.
EFR32MG24A010F1536IM48-B
Silicon Labs
EFR32MG24A010F1536IM48-B by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
XC7Z014S-2CLG400I
The Xilinx XC7Z014S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.
MCIMX27VOP4A
MCIMX27VOP4A by NXP Semiconductors is a 404-terminal System on Chip with CMOS technology. It operates b/w -20 to 85 °C and has a supply voltage range of 1.38-1.52 V. Ideal for applications requiring low profile, fine pitch grid array packages.
ESP32-S3-WROOM-1-N16R8
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1-N16R8 by Espressif Systems is a SoC with 41 terminals, operating at 3.3V nominal voltage and up to 65°C. Its compact MICROELECTRONIC ASSEMBLY package makes it suitable for IoT devices requiring low power consumption and high performance in a small form factor. With a max supply voltage of 3.6V, it is ideal for applications where space constraints are critical.
MCP25020-I/P
MCP25020-I/P by Microchip: 8-bit peripheral IC, operates at -40 to 85 °C, with supply voltage of 2.7-5.5 V. Ideal for industrial applications requiring microprocessor circuits in a rectangular package style with dual terminals.
MSP430F67791AIPEUR
MSP430F67791AIPEUR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.
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NT3H2111W0FHKH
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVQCCN; Package Shape: SQUARE;
NT3H2111W0FTTJ
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30;
NT3H2211W0FHKH
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
NT3H2111W0FT1X
MICROPROCESSOR CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1;
NT3H2111W0FHK
NT3H2111W0FHK by NXP Semiconductors is a surface mount microprocessor circuit with 8 terminals. It operates at a supply voltage range of 1.67V to 3.6V and can withstand temperatures from -40°C to 105°C. This chip carrier package is commonly used in industrial applications requiring NFC functionality.
NT3H2211W0FTTJ
MICROPROCESSOR CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e4;
NT3H1101W0FHKH
NT3H1101W0FHKH by NXP Semiconductors is an 8-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 95°C, suitable for industrial applications. With a supply voltage range of 1.7V to 3.6V, it is ideal for various functions in uPs and uCs.
NT3H1101W0FHK
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: VQCCN; Package Shape: SQUARE;
NT3H2111W0FUG
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Package Shape: UNSPECIFIED; Technology: CMOS; Minimum Operating Temperature: -40 Cel; Minimum Supply Voltage: 1.67 V;
NT3H1201W0FTTJ
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): 260;
NT3H2211W0FHK
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: QCCN; Package Shape: SQUARE;
NT3H1201W0FTT
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
NT3H1101W0FTTJ
NT3H1101W0FUG
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES;
NT3H1201W0FUG
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N;
NT3H2211W0FT1
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
NT3H1201W0FHK
NT3H2111W0FT1
NT3H1101W0FTT
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