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NT3H1201W0FHK

NXP Semiconductors

NT3H1201W0FHK by NXP Semiconductors

NT3H1201W0FHK by NXP Semiconductors is a CMOS microprocessor circuit with a supply voltage range of 1.8V to 3.6V and operates in extreme temperatures from -40 °C to 85 °C. It features an ultra-thin profile, making it ideal for compact applications. This surface-mount IC is perfect for industrial use where space and reliability are crucial.

Median Price

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Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,858 parts In-Stock

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Anansix

USA . 1,933 parts In-Stock

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Vyrian

USA . 744 parts In-Stock

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Corohmni

South Africa . 655 parts In-Stock

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$31.313

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655

$31.313

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One Stop Electronics

USA . 1,216 parts In-Stock

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$33.000

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Kepictronics

USA . 21,575 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,263 parts In-Stock

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Corphita

USA . 2,668 parts In-Stock

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UNI Independent Distributors

Spain . 1,208 parts In-Stock

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Overview

Unlock the potential of your projects with the NT3H1201W0FHK from NXP Semiconductors, a leader in innovative technology. This compact and robust microprocessor circuit delivers exceptional performance in demanding environments, ensuring reliability and efficiency. Perfect for industrial applications, it enhances connectivity while maintaining low power consumption. Experience superior quality and support from a trusted manufacturer, boosting your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material helps ensure that the product withstands various environmental conditions, enhancing reliability.

Surface Mount: YES

Surface mount technology allows for efficient assembly and compact design, making it suitable for modern electronics.

Maximum Supply Voltage: 3.6 V

The ability to operate at a higher voltage level provides flexibility in various applications, supporting a range of devices.

Package Shape: SQUARE

A square shape allows for versatile placement on PCBs and optimizes space utilization, beneficial in compact designs.

No. of Terminals: 8

Having 8 terminals makes it suitable for multi-function applications while maintaining simplicity in design.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile is ideal for applications where space is at a premium and can support lightweight designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enhances energy efficiency making it perfect for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can function efficiently in warmer environments, expanding its usability.

Minimum Operating Temperature: -40 °C

Operating in extreme cold conditions makes this product suitable for various industrial applications and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This combination of materials offers excellent corrosion resistance and ensures reliable connectivity over time.

Terminal Position: QUAD

The quad terminal position facilitates easy routing and connection on PCBs, improving design flexibility.

Maximum Seated Height: 0.5 mm

A low seated height helps in achieving a low-profile design, which is essential for modern slim electronic devices.

Width: 1.6 mm

The narrow width allows it to fit into tight spaces on PCBs, making it an excellent choice for compact designs.

Maximum Time At Peak Reflow Temperature: 30 s

Short reflow times ensure the components can be processed quickly, improving overall production efficiency.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature capability allows for better soldering processes, enhancing performance and reliability.

Length: 1.6 mm

A short length helps maximize the density of components on a PCB, which is beneficial in modern electronic applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product assures durability and performance under harsh conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

This classification allows for extensive processing capabilities, making it suitable for complex and diverse applications.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, which are critical for efficient device operation.

Terminal Form: NO LEAD

Lead-free construction is environmentally friendly and aligns with industry standards for safety and sustainability.

Terminal Pitch: 0.5 mm

The fine terminal pitch is advantageous for high-density applications, allowing for compact and efficient layouts.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs NT3H1201W0FHK attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Peripheral IC Type:

Trade Compliance

NT3H1201W0FHK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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