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MCIMX6Q5EYM10AC

NXP Semiconductors

MCIMX6Q5EYM10AC by NXP Semiconductors

MCIMX6Q5EYM10AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C and has a supply voltage range of 1.35V to 1.5V. With 624 terminals in a GRID ARRAY package, it's ideal for applications requiring low profile, fine pitch ICs.

Median Price

$82.620

Lifecycle Status

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Chip1Stop

Japan . 304 parts In-Stock

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Arrow

USA . 24 parts In-Stock

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DigiKey

USA . 83 parts In-Stock

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Verical

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Rochester

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Digiode

USA . 3,792 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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TME

Poland . 10,200 parts In-Stock

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Electronic Treasures

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ComSIT USA

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Vyrian

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$18.449

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Aztec Data Supply Inc.

USA . 237 parts In-Stock

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Ampacity Inc.

Singapore . 261 parts In-Stock

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Semicontronic

India . 1,633 parts In-Stock

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Corphita

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Corohmni

South Africa . 463 parts In-Stock

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Continental Prestige Electronics

USA . 3,319 parts In-Stock

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Netroflash

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Component Stockers USA

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Microchip USA

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Overview

Discover the innovative MCIMX6Q5EYM10AC from NXP Semiconductors, a leading manufacturer in the industry. This cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs and boasts a multitude of applications. With a focus on quality and reliability, this chip offers customers unmatched value and benefits. Experience seamless performance, versatility, and efficiency like never before with the MCIMX6Q5EYM10AC. Trust NXP Semiconductors to deliver top-notch solutions for all your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.5 V

The high maximum supply voltage provides flexibility in power requirements for various applications.

Package Shape: SQUARE

The square shape allows for efficient use of PCB real estate and easier layout design.

No. of Terminals: 624

High number of terminals provide connectivity options for multiple external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style enables compact design and efficient signal routing.

Minimum Supply Voltage: 1.35 V

The low minimum supply voltage ensures compatibility with various power sources.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures reliability in harsh operating conditions.

Minimum Operating Temperature: -20 °C

Wide operating temperature range allows for use in diverse environments.

Terminal Finish: TIN SILVER COPPER

The use of multiple terminal finishes ensures good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing of traces.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact and slim product designs.

Width: 21 mm

Optimal width for balance between size and functionality in diverse applications.

Maximum Time At Peak Reflow Temperature (s): 40

Short time at peak reflow temperature ensures component reliability during soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component integrity.

Length: 21 mm

Optimal length for balance between size and functionality in diverse applications.

Peripheral IC Type: SYSTEM ON CHIP

All-in-one solution with integrated peripherals for efficient system design.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form ensures reliable connections and ease of assembly.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high density integration and compact PCB layout.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard reflow soldering processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Q5EYM10AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

24MHZ NOMINAL FREQ AVAILABLE

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6Q5EYM10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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