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MIMXRT1171CVM8A

NXP Semiconductors

MIMXRT1171CVM8A by NXP Semiconductors

The NXP Semiconductors MIMXRT1171CVM8A is a SoC with CMOS technology, featuring 289 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.1-1.15V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.

Median Price

$12.338

Lifecycle Status

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12

In-Stock Inventory

1k+

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Chip1Stop

Japan . 152 parts In-Stock

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$17.700

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$12.500

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$11.800

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$11.700

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$17.700

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$11.700

DigiKey

USA . 47 parts In-Stock

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$17.820

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$13.228

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$11.377

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$17.820

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Verical

USA . 3,810 parts In-Stock

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$12.338

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$11.037

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$10.387

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$10.387

Rochester

USA . 3,690 parts In-Stock

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$9.870

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$8.830

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$8.310

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$8.310

EBV Elektronik

Germany . 1,064 parts In-Stock

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Future Electronics

Canada . 304 parts In-Stock

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Digiode

USA . 175 parts In-Stock

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$10.402

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Nova Conductors

Japan . 750 parts In-Stock

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Maritex

Poland . 132 parts In-Stock

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$25.094

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$14.115

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Vyrian

USA . 8,740 parts In-Stock

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Anansix

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TME

Poland . 895 parts In-Stock

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Semicontronic

India . 736 parts In-Stock

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$9.310

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$9.077

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$9.031

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Ampacity Inc.

Singapore . 269 parts In-Stock

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Corphita

USA . 4,701 parts In-Stock

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Continental Prestige Electronics

USA . 3,263 parts In-Stock

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$14.845

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$14.548

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Modulus Dynamics

Lithuania . 60 parts In-Stock

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$16.913

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$16.744

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$16.237

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Netroflash

USA . 2,000 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$23.176

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Aztec Data Supply Inc.

USA . 5,302 parts In-Stock

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$25.109

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Microchip USA

USA . 1,597 parts In-Stock

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Corohmni

South Africa . 1,015 parts In-Stock

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Lixinc

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UNI Independent Distributors

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Argo Parts USA

USA . 4,988 parts In-Stock

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Overview

Unlock the potential of your next project with the MIMXRT1171CVM8A by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers top-quality products that push the boundaries of innovation. This versatile IC is perfect for a wide range of applications, providing customers with unparalleled value, performance, and reliability. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, the MIMXRT1171CVM8A is the solution you need to bring your ideas to life. Trust NXP to deliver cutting-edge technology that empowers you to create without limits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the internal components of the IC.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product into electronic circuit designs and increases efficiency in assembly.

Maximum Supply Voltage: 1.15 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

The square package shape enables a more compact design and efficient use of space on a circuit board.

No. of Terminals: 289

With a high number of terminals, this IC can accommodate a wide range of connections and functions, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for high-density packaging of the IC, ideal for applications where space is limited.

Minimum Supply Voltage: 1.1 V

The low minimum supply voltage helps in reducing power consumption and ensures compatibility with various power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this IC suitable for use in harsh environmental conditions and ensures reliable performance under stress.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature extends the range of operating environments where this IC can be used, providing versatility.

Terminal Position: BOTTOM

The terminal position at the bottom of the IC simplifies connections and facilitates a clean layout on the circuit board.

Maximum Seated Height: 1.52 mm

The low maximum seated height allows for a slim profile, making it suitable for applications where space constraints are a concern.

Width: 14 mm

The compact width of the IC enables efficient use of space on a circuit board and facilitates a neat and organized layout.

Maximum Time At Peak Reflow Temperature (s): 40

The generous time allowed at peak reflow temperature ensures proper soldering and reliability in assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures robustness during the soldering process and reliability in operation.

Length: 14 mm

The compact length of the IC contributes to a space-efficient design and allows for flexibility in layout arrangements on a circuit board.

Peripheral IC Type: SoC

Being a System on Chip (SoC) peripheral IC means that this product integrates multiple functions into a single chip, reducing the need for additional components and simplifying overall design.

Technology: CMOS

The CMOS technology used in this IC ensures low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form: BALL

The ball terminal form allows for reliable and secure connections, making it ideal for applications where stability and longevity are crucial.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density packaging and fine connections, making this IC suitable for applications with limited space.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC is more resistant to moisture-related issues during storage and assembly, improving reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMXRT1171CVM8A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMXRT1171CVM8A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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