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XC7Z030-L2FFG676I

Xilinx

XC7Z030-L2FFG676I by Xilinx

XC7Z030-L2FFG676I by Xilinx is a 676-terminal System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$647.340

Lifecycle Status

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5

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Digiode

USA . 135 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 583 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Corohmni

South Africa . 120 parts In-Stock

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 277 parts In-Stock

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Texas Native Microelectronics

USA . 991 parts In-Stock

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Kenton Components

USA . 25 parts In-Stock

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Qasali Group International

UK . 45 parts In-Stock

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Vigor

Singapore . 250 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 3 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 5,996 parts In-Stock

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Argo Parts USA

USA . 4,015 parts In-Stock

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Netroflash

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A-Z Elektronik GmbH

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Lixinc

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Overview

Unlock the power of cutting-edge technology with the XC7Z030-L2FFG676I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that provide unmatched performance and reliability. This System on Chip peripheral IC is perfect for a wide range of applications, offering customers seamless integration and enhanced functionality. Experience the value and benefits that this innovative product brings to the table, setting you apart from the competition and driving success in your projects. Elevate your technology game with Xilinx's XC7Z030-L2FFG676I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Being surface mountable makes it easier to integrate the product onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for reliable operation and flexibility in power supply options.

Package Shape: SQUARE

Square shape helps in efficient use of space on PCBs and enables easy alignment during assembly.

No. of Terminals: 676

Having a high number of terminals allows for versatile connections and interfaces, expanding the range of applications for the product.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and signal integrity, especially in high-frequency applications.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage enables energy-efficient operation and helps in extending the product's battery life.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures stable performance even in challenging thermal conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the product to function reliably in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy access and connection to other components on the PCB.

Maximum Seated Height: 3.24 mm

Low seated height helps in reducing the overall profile of the product, making it suitable for space-constrained applications.

Width: 27 mm

Compact width dimension allows for efficient placement on the PCB and aids in optimizing board space.

Length: 27 mm

Square-shaped package with matching length and width dimensions supports uniform layout and alignment in PCB designs.

Peripheral IC Type: SYSTEM ON CHIP

Integration of various peripherals on a single chip enhances system functionality and simplifies design complexity.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and faster switching speeds, contributing to overall product efficiency.

Terminal Form: BALL

Ball terminal form provides reliable connections and enables finer pitch, enhancing the product's overall performance.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density mounting and efficient use of PCB space, enabling compact device designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-L2FFG676I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-L2FFG676I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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