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CY8CPLC10-28PVXI

Infineon Technologies

CY8CPLC10-28PVXI by Infineon Technologies

CY8CPLC10-28PVXI by Infineon Technologies is a 28-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85°C, suitable for industrial applications. With a supply voltage range of 4.75V to 5.25V and compact dimensions of 10.2mm x 5.3mm x 2mm, it's ideal for small outline designs requiring high performance in limited space.

Median Price

$13.404

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 229 parts In-Stock

1+ parts

$17.350

100+ parts

$11.710

1k+ parts

$11.150

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229

$17.350

$11.710

$11.150

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Verical

USA . 940 parts In-Stock

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$13.507

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940

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$13.507

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Rochester

USA . 323 parts In-Stock

1+ parts

-

100+ parts

$10.110

1k+ parts

$9.040

10k+ parts

$8.510

323

-

$10.110

$9.040

$8.510

DigiKey

USA . 323 parts In-Stock

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$13.300

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323

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$13.300

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Distributors (In-Stock)

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Digiode

USA . 870 parts In-Stock

1+ parts

$10.659

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870

$10.659

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Nova Conductors

Japan . 27 parts In-Stock

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$13.792

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27

$13.792

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Vyrian

USA . 1,668 parts In-Stock

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1,668

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DigiKey Marketplace

USA . 173 parts In-Stock

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173

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,627 parts In-Stock

1+ parts

$9.540

100+ parts

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1,627

$9.540

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Corphita

USA . 941 parts In-Stock

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$10.098

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941

$10.098

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Bastille Electronics

Australia . 550 parts In-Stock

1+ parts

$13.790

100+ parts

$13.100

1k+ parts

-

10k+ parts

$12.273

550

$13.790

$13.100

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$12.273

Continental Prestige Electronics

USA . 1,951 parts In-Stock

1+ parts

$13.792

100+ parts

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10k+ parts

$13.516

1,951

$13.792

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$13.516

Microchip USA

USA . 2,915 parts In-Stock

1+ parts

$20.220

100+ parts

$20.090

1k+ parts

$20.030

10k+ parts

$19.970

2,915

$20.220

$20.090

$20.030

$19.970

Corohmni

South Africa . 47 parts In-Stock

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$29.938

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47

$29.938

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Modulus Dynamics

Lithuania . 4,145 parts In-Stock

1+ parts

$64.532

100+ parts

$61.951

1k+ parts

$59.369

10k+ parts

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4,145

$64.532

$61.951

$59.369

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Argo Parts USA

USA . 1,872 parts In-Stock

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Perfect Parts

USA . 1,297 parts In-Stock

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1,297

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Overview

Discover the Infineon Technologies CY8CPLC10-28PVXI, a top-quality microprocessor circuit that offers unparalleled performance and reliability. Designed by a trusted manufacturer in the industry, this small outline, shrink pitch package is perfect for a wide range of applications. With a nominal supply voltage of 5V and industrial-grade temperature tolerance, this product ensures consistent operation even in challenging environments. Experience the benefits of cutting-edge technology with the CY8CPLC10-28PVXI, providing customers with exceptional value and unmatched advantages.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 5.25 V

Enables the IC to handle higher voltage inputs, increasing its versatility in different circuits.

Package Shape: RECTANGULAR

Compact and space-saving design that is commonly used in electronics, making it easy to integrate into systems.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, ensuring reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature settings, providing flexibility for use in different climate conditions.

Technology: CMOS

Utilizes low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CY8CPLC10-28PVXI attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

CY8CPLC10-28PVXI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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