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A2F200M3F-CSG288I

Microchip Technology

A2F200M3F-CSG288I by Microchip Technology

Microchip A2F200M3F-CSG288I is a 288-terminal SoC FPGA with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 1.425-1.575 V. Ideal for applications requiring thin profile and fine pitch grid array packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,270 parts In-Stock

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8,270

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Chip Stock

USA . 637 parts In-Stock

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637

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Nova Conductors

Japan . 50 parts In-Stock

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50

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VNN

France . 10 parts In-Stock

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10

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AZTECH Wire

Italy . 346 parts In-Stock

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$10.944

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346

$10.944

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Ampacity Inc.

Singapore . 223 parts In-Stock

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$19.000

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223

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Corohmni

South Africa . 881 parts In-Stock

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$23.250

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881

$23.250

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Semicontronic

India . 721 parts In-Stock

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$25.000

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$24.375

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$24.250

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721

$25.000

$24.375

$24.250

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$30.203

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$28.693

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$28.693

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$30.203

$28.693

$28.693

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Aztec Data Supply Inc.

USA . 268 parts In-Stock

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$65.190

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268

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CPlus Electronics

USA . 23,500 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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West Coast Incorporated

USA . 6,100 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,828 parts In-Stock

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Perfect Parts

USA . 5,322 parts In-Stock

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Microchip USA

USA . 4,958 parts In-Stock

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Glotronic Ltd.

UK . 3,140 parts In-Stock

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Argo Parts USA

USA . 3,080 parts In-Stock

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Continental Prestige Electronics

USA . 1,212 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Metaverse IC Inc.

Canada . 259 parts In-Stock

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Overview

Discover the cutting-edge A2F200M3F-CSG288I by Microchip Technology, a top-tier manufacturer known for reliability and innovation in the field of Other Function uPs,uCs & Peripheral ICs. This state-of-the-art product offers unmatched quality and performance, with applications ranging from consumer electronics to industrial automation. With a focus on value and customer satisfaction, the A2F200M3F-CSG288I provides numerous benefits and advantages, making it the ideal choice for your next project. Experience the difference with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for simplified assembly processes and reduced overall size of the product.

Maximum Supply Voltage: 1.575 V

This higher maximum supply voltage provides flexibility in power requirements for different applications.

Package Shape: SQUARE

The square shape can optimize space utilization and facilitate efficient PCB layout designs.

No. of Terminals: 288

Having a high number of terminals allows for greater connectivity options and functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers high density, precise alignment, and improved signal integrity for high-performance applications.

Minimum Supply Voltage: 1.425 V

The lower minimum supply voltage enables energy-efficient operation and can extend battery life in portable devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions and extended usage.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in both extreme cold and hot environments.

Terminal Position: BOTTOM

Bottom terminal positioning can assist in heat dissipation, improve signal integrity, and simplify PCB mounting.

Maximum Seated Height: 1.05 mm

The low maximum seated height contributes to a compact overall product profile and facilitates integration in space-constrained designs.

Width: 11 mm

The moderate width dimension allows for easy handling, placement, and routing within the PCB layout.

Length: 11 mm

The balanced length dimension offers uniformity and symmetry in the product's form factor, enhancing aesthetics and ease of installation.

Peripheral IC Type: SoC FPGA

The System-on-Chip Field-Programmable Gate Array integrates multiple functionalities, enabling complex processing tasks in a compact package.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption, high noise immunity, and compatibility with modern digital systems.

Terminal Form: BALL

Ball terminals offer secure electrical connections, mechanical strength, and enhanced signal integrity in a compact footprint.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage provides a standard operating range for optimal performance and compatibility with various power sources.

Terminal Pitch: 0.5 mm

The fine pitch spacing of terminals allows for high-density interconnections, reducing signal distortion and enhancing signal transmission capabilities.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product can withstand moderate moisture exposure during storage and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs A2F200M3F-CSG288I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B288

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

288

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.05 mm

Maximum Supply Voltage:

1.575 V

Minimum Supply Voltage:

1.425 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Trade Compliance

A2F200M3F-CSG288I Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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