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A2F200M3F-1CSG288

Microchip Technology

A2F200M3F-1CSG288 by Microchip Technology

A2F200M3F-1CSG288 by Microchip Technology is a SoC FPGA with 288 terminals, operating at 0-85°C. It features a thin profile grid array package and CMOS technology, suitable for applications requiring a supply voltage range of 1.425V to 1.575V. This surface-mount device has terminal finish of Tin Silver Copper and is ideal for various function uPs/uCs & peripheral ICs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,314 parts In-Stock

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6,314

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Nova Conductors

Japan . 500 parts In-Stock

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500

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VNN

France . 90 parts In-Stock

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90

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Ampacity Inc.

Singapore . 163 parts In-Stock

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$42.870

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163

$42.870

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Microchip USA

USA . 1,346 parts In-Stock

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$114.311

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Fulton Briggs Corp.

USA . 7,787 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Overview

Discover the exceptional quality and innovation of the A2F200M3F-1CSG288 by Microchip Technology. Designed with cutting-edge technology, this SoC FPGA offers unparalleled performance and versatility for a wide range of applications. Its grid array, thin profile package ensures reliable and efficient operation, while its fine pitch design maximizes space utilization. From advanced robotics to high-speed communication systems, this product delivers unmatched value and benefits to customers seeking reliability and performance in their electronic designs. Embrace the future of technology with the A2F200M3F-1CSG288 and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its lightweight, durable, and cost-effective properties.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall product size.

Maximum Supply Voltage: 1.575 V

A higher maximum supply voltage provides flexibility in power requirements and compatibility with various systems.

Package Shape: SQUARE

The square shape is ideal for optimizing space on a PCB and ensuring a compact design.

No. of Terminals: 288

A higher number of terminals allow for more connectivity options and functionality within the product.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers high-density interconnects and precise alignment for improved performance.

Minimum Supply Voltage: 1.425 V

The lower minimum supply voltage helps in reducing power consumption and enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for use in a wide range of environments and applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering during assembly.

Peripheral IC Type: SoC FPGA

The inclusion of System-on-Chip (SoC) Field-Programmable Gate Array (FPGA) enables versatile and customizable functionality.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminals provide reliable connections and are suitable for advanced mounting techniques.

Nominal Supply Voltage: 1.5 V

Having a close-to-nominal supply voltage ensures stability and compatibility with standard power sources.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates this product has a moderate moisture sensitivity, which is important for proper storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs A2F200M3F-1CSG288 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B288

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

288

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Supply Voltage:

1.575 V

Minimum Supply Voltage:

1.425 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

A2F200M3F-1CSG288 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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