Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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A2F200M3F-1FG484I by Microchip Technology is a SoC FPGA with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 1.425V to 1.575V. With 484 terminals in a grid array package, it's ideal for applications requiring high-performance computing in compact form factors.
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PLASTIC/EPOXY material provides durability and protection for the integrated circuits within, making this product a reliable choice.
Surface mount technology allows for easier integration onto PCBs, saving space and increasing flexibility in design.
Higher maximum supply voltage allows for more flexibility in power input requirements.
Square shape package allows for uniform placement on PCBs and efficient use of space.
High number of terminals enables connectivity to a wide range of external components and peripherals.
Grid array package style provides better thermal performance and electrical connections for the integrated circuits.
Lower minimum supply voltage allows for efficient power consumption and better energy management.
High maximum operating temperature ensures stable performance even in harsh environmental conditions.
Low minimum operating temperature allows for use in a wide range of environments, including extreme cold conditions.
Tin lead terminal finish provides good solderability and ensures reliable electrical connections.
System on Chip (SoC) Field-Programmable Gate Array (FPGA) integration offers versatile functionality and customization options.
CMOS technology offers low power consumption and high noise immunity, making the product suitable for various applications.
Ball terminal form is widely used for high-density interconnection and ensures secure connections.
Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.
Moisture Sensitivity Level 3 indicates the level of protection needed during handling and storage of the product, ensuring reliability in various environments.
Other Function uPs,uCs & Peripheral ICs A2F200M3F-1FG484I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology
JESD-30 Code:
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Package Style (Meter):
Maximum Supply Voltage:
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A2F200M3F-1FG484I Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Mult Dev Software Chg 8/Oct/2018 Mult Dev Design Advisory 13/Oct/2017
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
PCN Other - SmartFusion Fixes 11/Mar/2015
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
Silicon Transistor
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MCIMX535DVV1C
NXP Semiconductors
MCIMX535DVV1C by NXP Semiconductors is a System on Chip with 529 terminals, operating at -20 to 85°C. It has a supply voltage range of 0.9/1.25-1.3V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact form factors.
CY8C3866AXI-039T
Cypress Semiconductor
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
A13
Allwinner Technology
Allwinner Technology's A13 is a CMOS microprocessor circuit with 176 terminals in a flatpack package. It is used in Other Function uPs and uCs, featuring gull wing terminal form for surface mount applications. Ideal for various peripheral IC applications requiring high performance and compact design.
MGM210PA32JIA2R
Silicon Labs
SYSTEM ON CHIP;
SLM9670AQ20FW1311XTMA1
Infineon Technologies
SLM9670AQ20FW1311XTMA1 by Infineon is a 32-terminal IC with max supply voltage of 1.95V and min operating temp of -40°C. Ideal for cryptographic authentication applications due to its CMOS technology, quad terminal position, and compact square package style.
CY8C4024AZI-S413T
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Terminal Finish: PURE TIN;
MCP25050-E/SL
MCP25050-E/SL by Microchip: 8-bit microprocessor circuit with 5V supply, operating from -40 to 125 °C. Automotive grade, TS16949 screened IC in small outline package for surface mount applications. Features dual terminal position, CMOS technology, and matte tin finish on gull wing terminals.
AM6411BSCGHAALV
Texas Instruments
AM6411BSCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring high-performance computing in compact spaces.
EFR32MG21A020F768IM32-B
EFR32MG21A020F768IM32-B by Silicon Labs is a 32-terminal, square-shaped chip carrier with a supply voltage range of 1.71V to 3.8V. Operating b/w -40°C to 125°C, it's an automotive-grade System on Chip (SoC) with CMOS technology suitable for various IoT applications requiring compact and low-power solutions.
LTC4263CS#PBF
LTC4263CS#PBF by Analog Devices is a CMOS microprocessor circuit with 14 terminals, operating b/w 0-70°C. It has a supply voltage range of 4.5-5.5V and peak reflow temperature of 260°C. Ideal for various applications requiring small outline surface mount packages.
AM6231AGGGGHALW
AM6231AGGGGHALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 0.715-0.79 V. This grid array IC is ideal for applications requiring very thin profile and fine pitch packages.
Z84C4010PEG
Zilog
Other uPs/uCs/Peripheral ICs; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
XCZU11EG-1FFVC1156E
Xilinx
XCZU11EG-1FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it's ideal for applications requiring low power consumption and high performance.
LTC4263IDE#PBF
LTC4263IDE#PBF by Analog Devices is a MICROPROCESSOR CIRCUIT with 14 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 4.5-5.5 V and comes in a small outline package suitable for industrial applications requiring CMOS technology.
ATSHA204A-MAHCZ-T
ATSHA204A-MAHCZ-T by Microchip operates at 2-5.5V, with a temp range of -40 to 85°C. It's a cryptographic authenticator IC in a compact chip carrier package suitable for secure applications requiring high reliability and TS 16949 screening. Featuring dual terminals and CMOS tech, it's ideal for IoT devices needing robust security measures.
AX8052F143-3-TX30
AX8052F143-3-TX30 by Onsemi is a 40-terminal System on Chip with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.8V to 3.6V. Ideal for industrial applications requiring a compact, low-profile chip carrier package style.
CY8C4248LQI-BL573
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
MIMXRT1051CVJ5B
NXP Semiconductors' MIMXRT1051CVJ5B is a System on Chip with CMOS technology, operating at -40 to 105 °C. It features 196 terminals in a low profile grid array package style. Ideal for industrial applications requiring uPs and uCs with a supply voltage range of 1.15V to 1.26V.
5CSEBA6U23I7N
Intel
SoC;
VCBU68WMCE30
VCBU68WMCE30 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 338 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for low-power applications requiring high processing capabilities. The PLASTIC/EPOXY body material and BALL terminal form ensure durability and reliability in various electronic devices.
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A2F200M3F-CSG288I
Actel
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.425 V;
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B288;
Microsemi
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Technology: CMOS;
A2F200M3F-FGG256I
SoC FPGA; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
A2F200M3F-FG484
SoC FPGA; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
A2F200M3F-FG256I
SoC FPGA; Terminal Finish: TIN LEAD; Moisture Sensitivity Level (MSL): 3;
A2F200M3F-1FGG256I
SoC FPGA; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30;
A2F200M3F-CS288I
SoC FPGA; Terminal Finish: TIN LEAD SILVER;
A2F200M3F-1CS288I
A2F200M3F-1FGG484I
SoC FPGA; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
A2F200M3F-FG256YI
SoC FPGA; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
A2F200M3A-1FGG484
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
A2F200M3A-FG256
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
A2F200M3B-FG484
A2F200M3C-1FGG484
A2F200M3C-FG256
A2F200M3D-FG484
A2F200M3E-1FG484
A2F200M3F-1CSG288
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Surface Mount: YES;
A2F200M3F-1FG484
SoC FPGA; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
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