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SLB9670XQ20FW740XUMA2

Infineon Technologies

SLB9670XQ20FW740XUMA2 by Infineon Technologies

SLB9670XQ20FW740XUMA2 by Infineon Technologies is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it suitable for industrial applications requiring secure authentication processes. This chip carrier package with very thin profile and bottom terminal position is surface mountable, featuring 32 terminals in a square shape measuring 5mm x 5mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,125 parts In-Stock

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1,125

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Digiode

USA . 517 parts In-Stock

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517

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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AZTECH Wire

Italy . 435 parts In-Stock

1+ parts

$13.051

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435

$13.051

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Semicontronic

India . 915 parts In-Stock

1+ parts

$25.000

100+ parts

$24.375

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$24.250

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915

$25.000

$24.375

$24.250

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Aztec Data Supply Inc.

USA . 1,171 parts In-Stock

1+ parts

$31.460

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$31.460

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Ampacity Inc.

Singapore . 493 parts In-Stock

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$34.000

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493

$34.000

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Corohmni

South Africa . 3,051 parts In-Stock

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$36.193

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3,051

$36.193

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Modulus Dynamics

Lithuania . 4,477 parts In-Stock

1+ parts

$58.952

100+ parts

$56.594

1k+ parts

$54.236

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4,477

$58.952

$56.594

$54.236

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Perfect Parts

USA . 11,200 parts In-Stock

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11,200

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Continental Prestige Electronics

USA . 6,244 parts In-Stock

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Argo Parts USA

USA . 1,575 parts In-Stock

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1,575

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Corphita

USA . 544 parts In-Stock

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544

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Discover the cutting-edge technology behind the SLB9670XQ20FW740XUMA2 by Infineon Technologies. This innovative cryptographic authenticator offers unparalleled security and efficiency in a compact and durable package. Whether you're looking to enhance your IoT devices, secure your network infrastructure, or protect sensitive data, this product is the ultimate solution. Infineon Technologies, known for their commitment to quality and reliability, ensures that you can trust in the performance of this peripheral IC. Upgrade your systems with the SLB9670XQ20FW740XUMA2 and experience the benefits of top-notch security and seamless operation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the product, making it suitable for various environments.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.95 V

Provides a safe operating range for the product, ensuring reliability and preventing damage from overvoltage.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, maximizing component placement flexibility.

No. of Terminals: 32

Sufficient number of terminals for connectivity with other components, enabling versatile circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers enhanced thermal management, compact size, and low profile for space-constrained applications.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures product functionality in extreme cold conditions, increasing its applicability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure PCB mounting, enhancing the product's reliability during operation.

Maximum Seated Height: 0.9 mm

Low seated height enables slim and compact design, suitable for space-constrained applications.

Width: 5 mm

Compact width allows for efficient use of PCB space and enables dense component placement for optimized circuit design.

Length: 5 mm

Compact length contributes to the overall small footprint of the product, ideal for compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions, making it suitable for industrial applications.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

Incorporating cryptographic authentication technology enhances data security and integrity, making the product suitable for secure applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Terminal Form: NO LEAD

No-lead terminal form simplifies manufacturing processes, reduces environmental impact, and enhances reliability through improved solder joint integrity.

Nominal Supply Voltage: 1.8 V

Optimal nominal supply voltage for efficient and stable operation, ensuring compatibility with common power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density PCB design, allowing for compact layouts and efficient use of space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLB9670XQ20FW740XUMA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

Additional Features:

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Trade Compliance

SLB9670XQ20FW740XUMA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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