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SLB9665VQ20FW563XUMA3

Infineon Technologies

SLB9665VQ20FW563XUMA3 by Infineon Technologies

SLB9665VQ20FW563XUMA3 by Infineon: 32-terminal IC with max supply voltage of 3.6V, ideal for cryptographic authentication applications. CMOS tech, quad terminal position, and compact square package shape make it suitable for secure electronic systems requiring high data protection. Operating temp range -20 to 85°C ensures reliability in various environments.

Median Price

$1.770

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$1.770

100+ parts

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200

$1.770

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Vyrian

USA . 1,179 parts In-Stock

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1,179

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Digiode

USA . 210 parts In-Stock

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210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,204 parts In-Stock

1+ parts

$1.770

100+ parts

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2,204

$1.770

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Continental Prestige Electronics

USA . 241 parts In-Stock

1+ parts

$1.770

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10k+ parts

$1.735

241

$1.770

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$1.735

Ampacity Inc.

Singapore . 1,572 parts In-Stock

1+ parts

$9.000

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1,572

$9.000

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AZTECH Wire

Italy . 244 parts In-Stock

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$10.294

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244

$10.294

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Corohmni

South Africa . 2,126 parts In-Stock

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$33.583

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2,126

$33.583

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Aztec Data Supply Inc.

USA . 378 parts In-Stock

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$35.868

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378

$35.868

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Modulus Dynamics

Lithuania . 651 parts In-Stock

1+ parts

$54.269

100+ parts

$52.098

1k+ parts

$49.927

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651

$54.269

$52.098

$49.927

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 2,281 parts In-Stock

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2,281

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Corphita

USA . 406 parts In-Stock

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406

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$1.735

1k+ parts

$1.681

10k+ parts

$1.646

50

-

$1.735

$1.681

$1.646

Overview

Elevate your security with the SLB9665VQ20FW563XUMA3 by Infineon Technologies. This cutting-edge cryptographic authenticator offers top-notch quality and reliability, backed by the prestigious manufacturer. Perfect for a variety of applications in the realm of Other Function uPs, uCs & Peripheral ICs, this product stands out for its advanced technology and innovative design. Experience the value and benefits of enhanced security and performance with this versatile solution. Trust Infineon Technologies to deliver excellence in every aspect.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to damage, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving assembly time and space.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range, offering flexibility in power supply options.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

No. of Terminals: 32

Provides a higher number of terminals for connectivity and functionality in the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles offers a compact design with effective heat dissipation.

Minimum Supply Voltage: 3 V

Supports a lower voltage range, ensuring compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Capable of operating at higher temperatures, suitable for demanding environments.

Minimum Operating Temperature: -20 °C

Capable of operating in low-temperature conditions, enhancing versatility in usage.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

Provides a reliable and corrosion-resistant terminal finish for long-term performance.

Terminal Position: QUAD

Quad terminal position allows for efficient connection and versatility in circuit configurations.

Maximum Seated Height: 0.9 mm

Low seated height contributes to a slim profile and compact design of the product.

Width: 5 mm

Compact width dimension saves space on the circuit board, ideal for compact designs.

Length: 5 mm

Compact length dimension saves space on the circuit board, contributing to a space-efficient design.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

Incorporates advanced security features for data encryption and authentication, ensuring secure communication.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, enhancing efficiency.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and enhances product reliability.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density integration on the circuit board, optimizing space usage.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLB9665VQ20FW563XUMA3 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

SLB9665VQ20FW563XUMA3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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