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SLB9645VQ12FW13333XUMA1

Infineon Technologies

SLB9645VQ12FW13333XUMA1 by Infineon Technologies

SLB9645VQ12FW13333XUMA1 by Infineon: 32-terminal chip carrier with CMOS tech, operates b/w -20 to 85 °C. Ideal for cryptographic authentication applications due to its low profile and very thin package style. Supports supply voltage range of 1.62-1.98 V, making it suitable for various peripheral IC functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Sensible Micro Corp

USA . 4,368 parts In-Stock

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Digiode

USA . 454 parts In-Stock

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454

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Vyrian

USA . 426 parts In-Stock

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426

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Nova Conductors

Japan . 48 parts In-Stock

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48

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Ampacity Inc.

Singapore . 497 parts In-Stock

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$2.000

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497

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AZTECH Wire

Italy . 426 parts In-Stock

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$5.806

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426

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Aztec Data Supply Inc.

USA . 1,316 parts In-Stock

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$19.094

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$19.094

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Modulus Dynamics

Lithuania . 1,154 parts In-Stock

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$28.485

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$27.346

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$26.206

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1,154

$28.485

$27.346

$26.206

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Corohmni

South Africa . 18 parts In-Stock

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$59.982

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Continental Prestige Electronics

USA . 6,931 parts In-Stock

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Corphita

USA . 993 parts In-Stock

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Argo Parts USA

USA . 769 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the SLB9645VQ12FW13333XUMA1 by Infineon Technologies. Designed with precision and expertise, this product offers unparalleled quality and reliability in the realm of Other Function uPs, uCs & Peripheral ICs. Whether you're looking to enhance security through its cryptographic authenticator capabilities or streamline your operations with its advanced features, this product is sure to provide value, benefits, and advantages beyond compare. Elevate your projects to new heights with the SLB9645VQ12FW13333XUMA1 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards.

Maximum Supply Voltage: 1.98 V

The maximum supply voltage of 1.98 V ensures safe operation and prevents damage to the IC.

Package Shape: SQUARE

The square package shape is space-efficient and can be easily integrated into various electronic devices.

No. of Terminals: 32

Having 32 terminals provides ample connections for interfacing with other components in a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style of chip carrier, heat sink/slug, and very thin profile enables efficient heat dissipation and compact design.

Minimum Supply Voltage: 1.62 V

The minimum supply voltage of 1.62 V allows for flexible power input options.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the IC can withstand high temperature environments.

Minimum Operating Temperature: -20 °C

The ability to function at temperatures as low as -20°C ensures reliable performance in various conditions.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

The terminal finish of nickel, gold, palladium, and silver provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for easy connection and integration into circuit layouts.

Maximum Seated Height: 0.9 mm

With a maximum seated height of 0.9 mm, the IC can be installed in compact spaces.

Width: 5 mm

The 5 mm width makes the IC suitable for applications where space is limited.

Length: 5 mm

The 5 mm length contributes to the compact form factor of the IC.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

Being a cryptographic authenticator, the peripheral IC provides secure communication and data protection features.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and enhances reliability.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V is ideal for stable and efficient performance.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the IC can withstand moderate exposure to moisture during storage and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLB9645VQ12FW13333XUMA1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

SLB9645VQ12FW13333XUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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