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AM6421BSFGHAALV

Texas Instruments

AM6421BSFGHAALV by Texas Instruments

AM6421BSFGHAALV by Texas Instruments is a System on Chip with 441 terminals in a fine pitch grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring high-performance microcontrollers in compact designs.

Median Price

$32.360

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 38,793 parts In-Stock

1+ parts

$23.648

100+ parts

$20.657

1k+ parts

$14.246

10k+ parts

-

38,793

$23.648

$20.657

$14.246

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Mouser Electronics

USA . 224 parts In-Stock

1+ parts

$32.360

100+ parts

$23.720

1k+ parts

$22.620

10k+ parts

-

224

$32.360

$23.720

$22.620

-

DigiKey

USA . 142 parts In-Stock

1+ parts

$32.690

100+ parts

$23.375

1k+ parts

$22.374

10k+ parts

-

142

$32.690

$23.375

$22.374

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,562 parts In-Stock

1+ parts

$22.466

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-

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2,562

$22.466

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$23.590

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100

$23.590

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Chip Stock

USA . 5,620 parts In-Stock

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5,620

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Vyrian

USA . 3,981 parts In-Stock

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3,981

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VNN

France . 1,914 parts In-Stock

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1,914

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TME

Poland . 336 parts In-Stock

1+ parts

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$23.980

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336

-

$23.980

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 540 parts In-Stock

1+ parts

$6.610

100+ parts

-

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540

$6.610

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Ampacity Inc.

Singapore . 12,789 parts In-Stock

1+ parts

$20.100

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12,789

$20.100

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Semicontronic

India . 12,688 parts In-Stock

1+ parts

$20.100

100+ parts

$19.598

1k+ parts

$19.497

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12,688

$20.100

$19.598

$19.497

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Corphita

USA . 4,976 parts In-Stock

1+ parts

$21.283

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4,976

$21.283

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Continental Prestige Electronics

USA . 1,894 parts In-Stock

1+ parts

$23.590

100+ parts

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10k+ parts

$23.118

1,894

$23.590

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-

$23.118

Netroflash

USA . 50 parts In-Stock

1+ parts

$23.590

100+ parts

-

1k+ parts

$22.411

10k+ parts

$21.939

50

$23.590

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$22.411

$21.939

Argo Parts USA

USA . 4,186 parts In-Stock

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4,186

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$2.715

1k+ parts

$2.715

10k+ parts

$2.715

100

-

$2.715

$2.715

$2.715

Overview

Experience the cutting-edge technology of the AM6421BSFGHAALV by Texas Instruments, a top-of-the-line Other Function uPs,uCs & Peripheral ICs. With a reputation for excellence, Texas Instruments delivers unmatched quality and reliability in every product they create. This versatile chip is perfect for a wide range of applications, offering customers seamless integration and superior performance. Unlock endless possibilities with the AM6421BSFGHAALV and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring long-lasting performance and reliability.

Surface Mount: YES

Allows for easy and efficient integration into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 0.79 V

Supports a wide range of voltage inputs, making the product versatile and compatible with various power sources.

Package Shape: SQUARE

Facilitates uniform and compact packaging, optimizing space utilization on the circuit board.

No. of Terminals: 441

Provides ample connectivity options for interfacing with other components, enhancing the product's versatility and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables high-density packaging and precise alignment of terminals, improving overall performance and signal integrity.

Minimum Supply Voltage: 0.715 V

Ensures reliable operation even at low voltage levels, increasing the product's efficiency and robustness.

Maximum Operating Temperature: 105 °C

Allows the product to withstand high temperatures, making it suitable for a wide range of operating environments.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme cold conditions, enhancing the product's reliability and durability.

Terminal Position: BOTTOM

Simplifies the connection process and ensures secure and stable interfacing with other components on the circuit board.

Maximum Seated Height: 2.652 mm

Provides compact and low-profile packaging, saving space and enabling easy integration into various electronic devices.

Width: 17.2 mm

Offers a compact form factor, allowing for efficient use of space on the circuit board and in the overall electronic system.

Maximum Time At Peak Reflow Temperature (s): 30

Supports quick and reliable soldering process, ensuring secure attachment to the circuit board without risk of damage to the components.

Peak Reflow Temperature °C: 250

Withstands high reflow temperatures during the soldering process, ensuring proper bonding and long-term reliability of the product.

Length: 17.2 mm

Provides a balanced form factor, complementing the width and height specifications for optimal integration and space utilization.

Peripheral IC Type: SYSTEM ON CHIP

Integrates multiple functions into a single chip, reducing the need for additional components and simplifying the overall design and assembly process.

Technology: CMOS

Utilizes low power consumption and high noise immunity, enhancing the product's efficiency and reliability in various operating conditions.

Terminal Form: BALL

Facilitates easy and robust connections, ensuring stable and reliable interfacing with other components on the circuit board.

Nominal Supply Voltage: 0.75 V

Operates efficiently at the specified voltage level, providing consistent performance and reliability throughout its lifespan.

Terminal Pitch: 0.8 mm

Enables precise and efficient placement of terminals, ensuring secure connections and optimal signal transmission for enhanced performance.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture damage, ensuring the product's reliability and longevity in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6421BSFGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6421BSFGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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