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AM6421BSFFHAALV

Texas Instruments

AM6421BSFFHAALV by Texas Instruments

AM6421BSFFHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It features 441 terminals in a GRID ARRAY, FINE PITCH package style. Operating b/w -40 to 105 °C, it's ideal for applications requiring low power consumption and high performance in compact designs.

Median Price

$31.020

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,891 parts In-Stock

1+ parts

$23.310

100+ parts

$20.720

1k+ parts

$15.235

10k+ parts

-

2,891

$23.310

$20.720

$15.235

-

DigiKey

USA . 300 parts In-Stock

1+ parts

$31.020

100+ parts

$22.168

1k+ parts

$21.216

10k+ parts

-

300

$31.020

$22.168

$21.216

-

Mouser Electronics

USA . 370 parts In-Stock

1+ parts

$34.110

100+ parts

$23.800

1k+ parts

$23.460

10k+ parts

-

370

$34.110

$23.800

$23.460

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,024 parts In-Stock

1+ parts

$22.144

100+ parts

-

1k+ parts

-

10k+ parts

-

2,024

$22.144

-

-

-

Vyrian

USA . 5,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,636

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,160 parts In-Stock

1+ parts

$19.810

100+ parts

$19.315

1k+ parts

$19.216

10k+ parts

-

1,160

$19.810

$19.315

$19.216

-

Ampacity Inc.

Singapore . 1,133 parts In-Stock

1+ parts

$19.810

100+ parts

-

1k+ parts

-

10k+ parts

-

1,133

$19.810

-

-

-

Corphita

USA . 952 parts In-Stock

1+ parts

$20.979

100+ parts

-

1k+ parts

-

10k+ parts

-

952

$20.979

-

-

-

Corohmni

South Africa . 424 parts In-Stock

1+ parts

$23.310

100+ parts

-

1k+ parts

-

10k+ parts

-

424

$23.310

-

-

-

Component Stockers USA

USA . 4,699 parts In-Stock

1+ parts

$29.230

100+ parts

$23.010

1k+ parts

$16.500

10k+ parts

-

4,699

$29.230

$23.010

$16.500

-

Microchip USA

USA . 2,700 parts In-Stock

1+ parts

$68.310

100+ parts

$67.120

1k+ parts

$66.530

10k+ parts

$65.930

2,700

$68.310

$67.120

$66.530

$65.930

Northwest PG Solutions

USA . 1,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,228

-

-

-

-

Native Components

USA . 993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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993

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-

-

-

Overview

Experience the innovation and reliability of Texas Instruments with the AM6421BSFFHAALV, a cutting-edge System on Chip peripheral IC. This state-of-the-art product offers unparalleled performance and versatility for a wide range of applications. With its high-quality construction and advanced technology, customers can trust in the value and benefits that this product provides. Take your projects to the next level with Texas Instruments and the AM6421BSFFHAALV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring reliability and longevity.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 0.79 V

The low maximum supply voltage helps in minimizing power consumption and heat generation, making the product energy-efficient.

Package Shape: SQUARE

The square package shape allows for compact and efficient placement on the circuit board, optimizing space usage.

No. of Terminals: 441

Having a high number of terminals enables connectivity to multiple external components, expanding the functionality of the product.

Package Style: GRID ARRAY, FINE PITCH

The fine pitch grid array package style allows for high-density mounting, enhancing performance and reducing PCB footprint.

Minimum Supply Voltage: 0.715 V

The low minimum supply voltage ensures stable operation even under low power conditions, increasing reliability.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring continuous performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for a wide range of applications, even in cold environments.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easy and secure connection to the PCB, enhancing stability and reliability.

Maximum Seated Height: 2.652 mm

The low seated height enables a compact design, making the product suitable for space-constrained applications.

Width: 17.2 mm

A moderate width allows for easy integration into various electronic systems, providing flexibility in design.

Peak Reflow Temperature: 250

The high peak reflow temperature ensures reliable soldering during assembly, preventing any potential connection issues.

Length: 17.2 mm

A moderate length allows for versatile placement on the PCB, accommodating different layout requirements.

Peripheral IC Type: SYSTEM ON CHIP

Being a system on chip peripheral IC type, the product offers integrated functionality, reducing the need for additional components and simplifying the design.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, enhancing the overall performance of the product.

Terminal Form: BALL

Having ball terminals facilitates reliable and efficient connection to the PCB, ensuring stable operation under varying conditions.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage provides a standard operating range, ensuring compatibility with various power sources.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting and precise connections, improving overall performance and reliability.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, the product can withstand typical assembly and storage conditions, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6421BSFFHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6421BSFFHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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