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AM6412BKCGHAALV

Texas Instruments

AM6412BKCGHAALV by Texas Instruments

AM6412BKCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high performance and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,412 parts In-Stock

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VNN

France . 2,994 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Digiode

USA . 141 parts In-Stock

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One Stop Electronics

USA . 1,189 parts In-Stock

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$8.000

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Ampacity Inc.

Singapore . 1,106 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 323 parts In-Stock

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$18.179

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Continental Prestige Electronics

USA . 4,812 parts In-Stock

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Argo Parts USA

USA . 3,575 parts In-Stock

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Corphita

USA . 2,254 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Experience the cutting-edge technology of the AM6412BKCGHAALV by Texas Instruments. With a focus on quality and innovation, Texas Instruments is a trusted manufacturer in the industry. This versatile product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering a wide range of applications for various electronics. Customers can expect exceptional value, benefits, and advantages when choosing this product, making it the perfect choice for all their electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it a good choice for long-term use.

Surface Mount: YES

The surface-mount feature simplifies assembly and allows for compact designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 0.79 V

This low maximum supply voltage helps reduce power consumption and extends battery life, making it energy-efficient.

Package Shape: SQUARE

The square shape allows for efficient use of board space and easy placement, making it a convenient option for compact designs.

No. of Terminals: 441

With a high number of terminals, this product offers versatility and connectivity options for various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design provide high-density packaging and improved signal integrity, making it suitable for high-performance applications.

Minimum Supply Voltage: 0.715 V

This low minimum supply voltage ensures stable operation and performance, even under low power conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand harsh environments and extended use without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to perform reliably in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it efficient and user-friendly.

Maximum Seated Height: 2.652 mm

With a low seated height, this product can be used in slim devices and applications where space is limited.

Width: 17.2 mm

The width of 17.2mm provides a compact form factor, making it suitable for applications where space is a premium.

Length: 17.2 mm

The length of 17.2mm offers a square design, enabling efficient use of board space and placement flexibility.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip integration offers functionality and versatility in a single package, reducing the need for additional components and simplifying design.

Technology: CMOS

The CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital systems, making it a versatile and reliable choice.

Terminal Form: BALL

The ball terminal form ensures reliable connections and good solderability, making it easy to integrate into a PCB design.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75V offers a balance between performance and power efficiency, making it an optimal choice for a wide range of applications.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8mm, this product offers high-density connectivity and compatibility with modern PCB designs, making it ideal for space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6412BKCGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6412BKCGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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