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CC1310F32RGZR

Texas Instruments

CC1310F32RGZR by Texas Instruments

CC1310F32RGZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes, operating at -40 to 85 °C. It features a CORTEX-M3 CPU Family, 48 terminals in a SQUARE package style, and supports supply voltages from 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.

Median Price

$5.493

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,424 parts In-Stock

1+ parts

$3.836

100+ parts

$3.361

1k+ parts

$1.899

10k+ parts

-

27,424

$3.836

$3.361

$1.899

-

Mouser Electronics

USA . 1,125 parts In-Stock

1+ parts

$7.150

100+ parts

$4.310

1k+ parts

$3.090

10k+ parts

$2.960

1,125

$7.150

$4.310

$3.090

$2.960

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$2.871

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$2.871

-

-

-

Digiode

USA . 2,028 parts In-Stock

1+ parts

$3.644

100+ parts

-

1k+ parts

-

10k+ parts

-

2,028

$3.644

-

-

-

Vyrian

USA . 13,953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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13,953

-

-

-

-

Chip Stock

USA . 155 parts In-Stock

1+ parts

-

100+ parts

-

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-

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155

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$2.814

100+ parts

-

1k+ parts

$2.701

10k+ parts

-

500

$2.814

-

$2.701

-

Continental Prestige Electronics

USA . 3,827 parts In-Stock

1+ parts

$2.871

100+ parts

-

1k+ parts

-

10k+ parts

$2.814

3,827

$2.871

-

-

$2.814

Argo Parts USA

USA . 305 parts In-Stock

1+ parts

$2.871

100+ parts

-

1k+ parts

-

10k+ parts

-

305

$2.871

-

-

-

Ampacity Inc.

Singapore . 14,097 parts In-Stock

1+ parts

$3.260

100+ parts

-

1k+ parts

-

10k+ parts

-

14,097

$3.260

-

-

-

Corphita

USA . 2,723 parts In-Stock

1+ parts

$3.452

100+ parts

-

1k+ parts

-

10k+ parts

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2,723

$3.452

-

-

-

Corohmni

South Africa . 1,041 parts In-Stock

1+ parts

$24.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$24.750

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$44.147

100+ parts

$40.174

1k+ parts

$36.201

10k+ parts

-

500

$44.147

$40.174

$36.201

-

Parana Technologies

USA . 735 parts In-Stock

1+ parts

$56.758

100+ parts

-

1k+ parts

-

10k+ parts

-

735

$56.758

-

-

-

ChromeModa Solutions

Germany . 1,766 parts In-Stock

1+ parts

$63.773

100+ parts

$52.294

1k+ parts

-

10k+ parts

-

1,766

$63.773

$52.294

-

-

IDEA Electronic Components Group

UK . 785 parts In-Stock

1+ parts

$63.773

100+ parts

$60.584

1k+ parts

$57.396

10k+ parts

-

785

$63.773

$60.584

$57.396

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,103 parts In-Stock

1+ parts

-

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25,103

-

-

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Lixinc

USA . 13,739 parts In-Stock

1+ parts

-

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13,739

-

-

-

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DigiPath Technology Company

USA . 2,197 parts In-Stock

1+ parts

-

100+ parts

$57.498

1k+ parts

-

10k+ parts

-

2,197

-

$57.498

-

-

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,500

-

-

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Perfect Parts

USA . 1,120 parts In-Stock

1+ parts

-

100+ parts

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1,120

-

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-

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Overview

Discover the cutting-edge CC1310F32RGZR by Texas Instruments, setting the standard for quality in the realm of Other Function uPs,uCs & Peripheral ICs. With a sleek package body material and advanced technology like the CORTEX-M3 CPU family, this product offers unparalleled performance in industrial applications. Trust in Texas Instruments' reputation for excellence and unlock the potential of your projects with the value and reliability that the CC1310F32RGZR brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 3.8 V

The high maximum supply voltage provides flexibility and compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape is compact and space-saving, ideal for applications where board space is limited.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption and optimizing energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in extreme conditions.

CPU Family: CORTEX-M3

Cortex-M3 CPU family offers high performance and efficiency for processing tasks, suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Width: 7 mm

Compact width allows for easy integration into tight spaces or densely packed PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can withstand harsh environmental conditions and extended operating durations.

RAM Bytes: 28672

Large RAM capacity enables efficient data processing and multitasking capabilities, enhancing overall system performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling more functionality in a smaller footprint.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC has a moderate moisture sensitivity level, suitable for standard PCB assembly and reflow processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F32RGZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CC1310F32RGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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