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CC1310F64RHBR

Texas Instruments

CC1310F64RHBR by Texas Instruments

CC1310F64RHBR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 Bytes of RAM. It operates on a supply voltage range of 1.8V to 3.8V, suitable for INDUSTRIAL applications. This CMOS technology chip has a compact SQUARE package style and can withstand temperatures from -40°C to 85°C.

Median Price

$5.313

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,832 parts In-Stock

1+ parts

$3.836

100+ parts

$3.361

1k+ parts

$1.899

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8,832

$3.836

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$1.899

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Mouser Electronics

USA . 2,853 parts In-Stock

1+ parts

$6.790

100+ parts

$4.520

1k+ parts

$3.400

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$3.250

2,853

$6.790

$4.520

$3.400

$3.250

Distributors (In-Stock)

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Digiode

USA . 533 parts In-Stock

1+ parts

$3.644

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533

$3.644

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Nova Conductors

Japan . 79 parts In-Stock

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$3.780

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Vyrian

USA . 5,525 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,250 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 5,465 parts In-Stock

1+ parts

$3.260

100+ parts

$3.178

1k+ parts

$3.162

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5,465

$3.260

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$3.162

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Ampacity Inc.

Singapore . 5,382 parts In-Stock

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$3.260

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$3.260

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Corphita

USA . 4,627 parts In-Stock

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$3.452

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Continental Prestige Electronics

USA . 5,964 parts In-Stock

1+ parts

$3.780

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$3.704

5,964

$3.780

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$3.704

Argo Parts USA

USA . 3,447 parts In-Stock

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$3.780

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$3.780

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Component Stockers USA

USA . 153,265 parts In-Stock

1+ parts

$5.690

100+ parts

$4.190

1k+ parts

$2.340

10k+ parts

$2.340

153,265

$5.690

$4.190

$2.340

$2.340

Corohmni

South Africa . 2,161 parts In-Stock

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$15.656

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Parana Technologies

USA . 1,136 parts In-Stock

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$42.174

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DigiPath Technology Company

USA . 432 parts In-Stock

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$46.438

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432

$46.438

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IDEA Electronic Components Group

UK . 2,155 parts In-Stock

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$47.386

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$45.017

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$42.647

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$47.386

$45.017

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ChromeModa Solutions

Germany . 1,519 parts In-Stock

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$47.386

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$38.857

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Futuretech Components

Singapore . 33,000 parts In-Stock

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Lixinc

USA . 18,240 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 10,523 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,708 parts In-Stock

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Alle Elektronik GmbH

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Kepictronics

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Perfect Parts

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Overview

Elevate your projects with the CC1310F64RHBR by Texas Instruments, a top-tier manufacturer known for producing high-quality ICs. This versatile microprocessor circuit is perfect for various applications in the industrial sector, offering unmatched performance and reliability. With a wide supply voltage range, low operating temperatures, and advanced technology, this chip ensures seamless integration and optimal functionality. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to external elements, making it suitable for various environments.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto PCBs, saving space and improving overall design flexibility.

Maximum Supply Voltage: 3.8 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing compatibility with different systems.

Package Shape: SQUARE

The square package shape allows for more efficient use of space on the PCB, optimizing the layout for better performance.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for various external components, enhancing the product's versatility in different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers improved thermal management and space efficiency, making it ideal for compact designs with efficient heat dissipation.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage requirement allows for operation in power-constrained environments, improving energy efficiency and reducing overall power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability and performance in harsh conditions, making it suitable for industrial applications with demanding environmental conditions.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family provides high performance and energy efficiency, making it a reliable choice for embedded systems requiring real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 to 85°C allows for operation in extreme cold environments, ensuring consistent performance in a variety of conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Terminal Position: QUAD

Having quad terminal positions allows for efficient signal routing and connections, enhancing the product's overall functionality and ease of integration.

Maximum Seated Height: 1 mm

With a low maximum seated height, this product can be used in slim and compact designs without compromising on performance or functionality.

Width: 5 mm

The compact 5mm width allows for efficient use of space on the PCB, enabling dense and high-performance electronic designs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during manufacturing processes, guaranteeing strong and durable connections for the product.

Length: 5 mm

The 5mm length offers a balanced form factor, making it suitable for a wide range of applications without compromising on performance or functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures reliable operation in harsh environmental conditions typically found in industrial settings, making it a robust and dependable choice for such applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integration of a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities, allowing for complex computations and tasks to be efficiently handled.

RAM Bytes: 28672

With a large RAM capacity of 28672 bytes, this product can handle extensive data processing and storage requirements, making it suitable for applications with high computational demands.

Technology: CMOS

Utilizing CMOS technology offers power efficiency and high-speed operation, ensuring optimal performance while minimizing energy consumption for enhanced overall efficiency.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and offers improved reliability, ensuring robust connections and minimizing the risk of lead contamination.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this product aligns with standard voltage levels commonly used in electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides high-density interconnect options, enabling efficient signal routing and minimizing PCB footprint for compact and space-saving designs.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates a moderate level of sensitivity to moisture during storage and handling, requiring appropriate precautions to ensure product reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F64RHBR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CC1310F64RHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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