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CC1310F64RGZR

Texas Instruments

CC1310F64RGZR by Texas Instruments

CC1310F64RGZR by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a compact, surface-mountable package.

Median Price

$3.987

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,434 parts In-Stock

1+ parts

$3.987

100+ parts

$3.494

1k+ parts

$1.974

10k+ parts

-

22,434

$3.987

$3.494

$1.974

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.628

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.628

-

-

-

Digiode

USA . 3,302 parts In-Stock

1+ parts

$3.788

100+ parts

-

1k+ parts

-

10k+ parts

-

3,302

$3.788

-

-

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Vyrian

USA . 7,631 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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7,631

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$2.628

100+ parts

$2.497

1k+ parts

$2.372

10k+ parts

$2.339

200

$2.628

$2.497

$2.372

$2.339

Continental Prestige Electronics

USA . 4,644 parts In-Stock

1+ parts

$2.628

100+ parts

-

1k+ parts

-

10k+ parts

$2.575

4,644

$2.628

-

-

$2.575

Argo Parts USA

USA . 333 parts In-Stock

1+ parts

$2.628

100+ parts

-

1k+ parts

-

10k+ parts

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333

$2.628

-

-

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Semicontronic

India . 21,987 parts In-Stock

1+ parts

$3.390

100+ parts

$3.305

1k+ parts

$3.288

10k+ parts

-

21,987

$3.390

$3.305

$3.288

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Ampacity Inc.

Singapore . 21,950 parts In-Stock

1+ parts

$3.390

100+ parts

-

1k+ parts

-

10k+ parts

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21,950

$3.390

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Corphita

USA . 2,874 parts In-Stock

1+ parts

$3.588

100+ parts

-

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2,874

$3.588

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AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$21.270

100+ parts

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703

$21.270

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Parana Technologies

USA . 1,568 parts In-Stock

1+ parts

$39.780

100+ parts

-

1k+ parts

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10k+ parts

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1,568

$39.780

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DigiPath Technology Company

USA . 1,838 parts In-Stock

1+ parts

$43.803

100+ parts

$40.299

1k+ parts

-

10k+ parts

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1,838

$43.803

$40.299

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IDEA Electronic Components Group

UK . 2,234 parts In-Stock

1+ parts

$44.697

100+ parts

$42.462

1k+ parts

$40.227

10k+ parts

-

2,234

$44.697

$42.462

$40.227

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ChromeModa Solutions

Germany . 1,463 parts In-Stock

1+ parts

$44.697

100+ parts

$36.652

1k+ parts

-

10k+ parts

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1,463

$44.697

$36.652

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Corohmni

South Africa . 3,065 parts In-Stock

1+ parts

$54.436

100+ parts

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10k+ parts

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3,065

$54.436

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

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100+ parts

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5,600

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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100+ parts

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1,500

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Overview

Experience the cutting-edge technology of the CC1310F64RGZR by Texas Instruments, a leading manufacturer known for its high-quality products. This versatile microprocessor circuit offers endless possibilities in various applications, thanks to its advanced features and reliable performance. From smart home devices to industrial automation, this innovative solution provides unmatched value and benefits to customers seeking efficient and robust solutions. Trust Texas Instruments to deliver excellence with the CC1310F64RGZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.8 V

The high maximum supply voltage allows for flexibility in power supply configurations, accommodating various system requirements.

Package Shape: SQUARE

The square package shape enables efficient use of PCB real estate, maximizing component density and space saving.

No. of Terminals: 48

The high number of terminals provides ample connectivity options, allowing for versatile integration with other components in a system.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, making the product suitable for industrial applications.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance and energy efficiency, making it ideal for embedded systems and IoT applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish enhances the product's reliability and ensures stable electrical connections over time.

Terminal Position: QUAD

The quad terminal position facilitates easy PCB layout and assembly, optimizing signal integrity and reducing interference.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact and slim form factor designs, particularly beneficial in space-constrained applications.

Width: 7 mm

The compact width dimension enables efficient placement and routing of the component on the PCB, enhancing overall system layout flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature minimizes thermal stress on the component during soldering processes, preserving its longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable solder joints and proper component attachment during the assembly process.

Length: 7 mm

The compact length dimension further contributes to space-saving designs and allows for efficient placement of the component on the PCB.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating indicates robustness and reliability in demanding operating environments, suitable for industrial automation and control applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities, enabling complex computing tasks and algorithm implementation.

RAM Bytes: 28672

The large RAM capacity provides ample memory for data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed performance, contributing to energy efficiency and improved system responsiveness.

Terminal Form: NO LEAD

The no lead terminal form simplifies the manufacturing process and reduces environmental impact, conforming to lead-free regulations.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage standardizes power requirements and ensures compatibility with a wide range of existing power sources.

Terminal Pitch: 0.5 mm

The tight terminal pitch allows for high-density mounting on the PCB, increasing component integration and enabling miniaturization of the overall system.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, requiring standard handling and storage precautions to maintain component reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F64RGZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CC1310F64RGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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