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MCIMX7D7DVM10SC

NXP Semiconductors

MCIMX7D7DVM10SC by NXP Semiconductors

MCIMX7D7DVM10SC by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating b/w 0-95°C. It has a supply voltage range of 1.045-1.25 V and uses BALL terminal form. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

Median Price

$28.650

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$28.650

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50

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Vyrian

USA . 6,840 parts In-Stock

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6,840

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Digiode

USA . 4,112 parts In-Stock

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Anansix

USA . 1,599 parts In-Stock

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Chip Stock

USA . 696 parts In-Stock

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Sensible Micro Corp

USA . 664 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 822 parts In-Stock

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$14.336

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822

$14.336

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One Stop Electronics

USA . 891 parts In-Stock

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$19.000

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891

$19.000

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Ampacity Inc.

Singapore . 865 parts In-Stock

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$19.000

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$19.000

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Corohmni

South Africa . 949 parts In-Stock

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$23.142

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$23.142

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Semicontronic

India . 1,610 parts In-Stock

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$27.000

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$26.325

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$26.190

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Continental Prestige Electronics

USA . 6,435 parts In-Stock

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$28.650

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$28.077

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$28.077

Netroflash

USA . 1,000 parts In-Stock

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$28.650

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$27.217

10k+ parts

$26.644

1,000

$28.650

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$27.217

$26.644

Aztec Data Supply Inc.

USA . 1,800 parts In-Stock

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$30.510

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Advanced Electronics

New Zealand . 33 parts In-Stock

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$51.334

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$48.767

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$48.767

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$51.334

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$48.767

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Microchip USA

USA . 2,313 parts In-Stock

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$62.428

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Lixinc

USA . 7,634 parts In-Stock

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UNI Independent Distributors

Spain . 5,276 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 643 parts In-Stock

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643

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Perfect Parts

USA . 282 parts In-Stock

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Argo Parts USA

USA . 65 parts In-Stock

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Overview

Elevate your projects with the MCIMX7D7DVM10SC by NXP Semiconductors, a cutting-edge SYSTEM ON CHIP designed to revolutionize the world of Other Function uPs,uCs & Peripheral ICs. With NXP Semiconductors' reputation for quality and innovation, this product offers unparalleled value and benefits to customers looking to push the boundaries of technology. From its low profile design to its high operating temperature range, the MCIMX7D7DVM10SC delivers reliability and performance like no other, making it the ideal choice for a wide range of applications. Experience the difference with NXP Semiconductors and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Surface mount feature allows for easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 1.25 V

High maximum supply voltage ensures stable operation and allows for compatibility with various power sources.

Package Shape: SQUARE

Square package shape offers efficient use of space on the PCB, ideal for compact designs.

No. of Terminals: 541

High number of terminals provides ample connectivity options and functionality for complex electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers high density and reliability in a compact form factor.

Minimum Supply Voltage: 1.045 V

Low minimum supply voltage ensures energy efficiency and compatibility with low-power applications.

Maximum Operating Temperature: 95 °C

High maximum operating temperature allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures operation in a wide range of thermal conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies soldering and assembly process, enhancing the overall reliability of the product.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables a slim profile design and facilitates installation in space-constrained environments.

Width: 19 mm

Moderate width provides a balance between compactness and ease of handling during assembly.

Maximum Time At Peak Reflow Temperature (s): 40

Sufficient time at peak reflow temperature ensures proper soldering and bonding of the IC to the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable solder joints and secure attachment to the PCB.

Length: 19 mm

Medium length offers a good balance between compactness and adequate space for terminal connections.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip design integrates multiple functions into a single IC, reducing system complexity and improving overall performance.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliability, making it suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form ensures reliable electrical connections and easy assembly on the PCB.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.75 mm

Fine terminal pitch allows for high-density packaging and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can be safely handled and stored in standard factory conditions without risk of moisture damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX7D7DVM10SC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B541

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

541

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA541,25X25,30

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX7D7DVM10SC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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