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MPFS250TS-FCG1152I

Microchip Technology

MPFS250TS-FCG1152I by Microchip Technology

MPFS250TS-FCG1152I by Microchip Technology is a programmable SoC with a package style of grid array and 1152 terminals. It operates at a voltage range of 0.97V to 1.03V and has a max seated height of 2.99mm. This IC is commonly used in applications requiring other function uPs, uCs, and peripheral devices.

Median Price

$512.810

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4 parts In-Stock

1+ parts

$512.810

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$512.810

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 57 parts In-Stock

1+ parts

$570.865

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$570.865

-

-

-

Vyrian

USA . 5,541 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,541

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 416 parts In-Stock

1+ parts

$17.760

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$17.760

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-

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Ampacity Inc.

Singapore . 8 parts In-Stock

1+ parts

$525.870

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$525.870

-

-

-

Continental Prestige Electronics

USA . 3,434 parts In-Stock

1+ parts

$570.865

100+ parts

-

1k+ parts

-

10k+ parts

$559.448

3,434

$570.865

-

-

$559.448

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$570.865

100+ parts

-

1k+ parts

$542.322

10k+ parts

$530.905

2,000

$570.865

-

$542.322

$530.905

Argo Parts USA

USA . 327 parts In-Stock

1+ parts

$570.865

100+ parts

$565.157

1k+ parts

$559.448

10k+ parts

$553.739

327

$570.865

$565.157

$559.448

$553.739

Microchip USA

USA . 1,761 parts In-Stock

1+ parts

$680.537

100+ parts

-

1k+ parts

-

10k+ parts

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1,761

$680.537

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-

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NIA Electronics

USA . 7,743 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,743

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Ledger Components

France . 7,743 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,743

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Montano Global Distributors

Canada . 7,455 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,455

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-

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LOOK Integrated Logistics

Peru . 2,486 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,486

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-

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LMD Electronica

Estonia . 1,784 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,784

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Overview

Experience unparalleled performance and reliability with the MPFS250TS-FCG1152I by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology is known for their superior quality and cutting-edge technology. This versatile product falls under the category of Other Function uPs, uCs & Peripheral ICs, making it suitable for various applications. But what sets the MPFS250TS-FCG1152I apart is its exceptional value, benefits, and advantages it brings to customers. Whether you're looking for enhanced processing power, advanced programmability, or seamless integration, this product delivers it all. Trust Microchip Technology to provide you with the best solution for your needs. Upgrade your devices and unlock their true potential with the MPFS250TS-FCG1152I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package body material of plastic/epoxy makes it lightweight and durable, making it a good choice for applications requiring portability and reliability.

Surface Mount: YES

With its surface mount capability, this product can easily be mounted on a PCB, increasing the efficiency and compactness of the overall system design.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage of 1.03 V allows this product to handle higher power requirements, making it suitable for applications that demand robust performance.

Package Shape: SQUARE

The square package shape of this product maximizes space utilization on the PCB, enabling a compact design for applications with limited board space.

No. of Terminals: 1152

With a high number of terminals, this product offers extensive connectivity options, making it versatile for various applications requiring multiple connections.

Package Style (Meter): GRID ARRAY

The grid array package style ensures a firm and reliable connection between the product and the PCB, improving overall system stability and durability.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage of 0.97 V makes this product energy-efficient and suitable for applications where power consumption is a concern.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this product can withstand harsh environmental conditions, making it reliable for applications that experience elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function reliably in extreme cold environments, making it suitable for a wide range of temperature-sensitive applications.

Terminal Position: BOTTOM

The terminal position at the bottom of this product simplifies the PCB layout, facilitating easier integration and reducing assembly complexity.

Maximum Seated Height: 2.99 mm

The low maximum seated height of 2.99 mm ensures that this product occupies minimal vertical space on the PCB, enabling slim and compact designs.

Width: 35 mm

With a width of 35 mm, this product offers a compact form factor, making it suitable for space-constrained applications.

Length: 35 mm

The length of 35 mm adds to the overall compactness of this product, enhancing its suitability for applications where size is a critical factor.

Peripheral IC Type: PROGRAMMABLE SoC

This product being a programmable System-on-Chip (SoC) allows for flexible customization and adaptability, making it ideal for applications that require versatility and scalability.

Technology: CMOS

The CMOS technology employed in this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a reliable choice for various applications.

Terminal Form: BALL

The ball terminal form ensures secure electrical connections, enhancing the overall system reliability and longevity.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V provides a standard voltage level for this product, making it compatible with a wide range of power supply sources and simplifying integration into diverse systems.

Terminal Pitch: 1 mm

The tight terminal pitch of 1 mm facilitates high-density PCB designs, enabling the product to be used in applications requiring multiple components in a small space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS250TS-FCG1152I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B1152

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1152,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.99 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

MPFS250TS-FCG1152I Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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