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MCIMX6X3EVN10AB

NXP Semiconductors

MCIMX6X3EVN10AB by NXP Semiconductors

MCIMX6X3EVN10AB by NXP Semiconductors is a SoC with 400 terminals in a low profile, fine pitch grid array package. It operates b/w -20 to 105 °C with supply voltage range of 1.35V to 1.5V. Ideal for commercial extended temperature grade applications requiring CMOS technology and surface mount compatibility.

Median Price

$27.074

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 18,455 parts In-Stock

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DigiKey

USA . 17,820 parts In-Stock

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$24.920

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Avnet

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Rochester

USA . 535 parts In-Stock

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$28.030

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$25.080

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$23.600

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Verical

USA . 185 parts In-Stock

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Digiode

USA . 4,582 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Flip Electronics

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Vyrian

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One Stop Electronics

USA . 3,948 parts In-Stock

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Semicontronic

India . 3,834 parts In-Stock

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$21.508

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$21.398

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Ampacity Inc.

Singapore . 3,547 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 2,107 parts In-Stock

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$31.850

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Netroflash

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$30.875

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$30.225

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Aztec Data Supply Inc.

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Corohmni

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Microchip USA

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Lixinc

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Argo Parts USA

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Overview

Discover the MCIMX6X3EVN10AB by NXP Semiconductors, a cutting-edge SoC peripheral IC that offers unparalleled quality and reliability. With a wide range of applications in the tech industry, this innovative product provides customers with advanced functionality and performance. From its sleek design to its high-grade materials, this device is designed to exceed expectations. Elevate your projects with the MCIMX6X3EVN10AB and experience the next level of technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable and long-lasting devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on circuit boards, saving time and space.

Maximum Supply Voltage: 1.5 V

Operates efficiently within a safe voltage range, ensuring stability and reliability of the product.

Package Shape: SQUARE

Square shape provides a compact form factor, fitting well in tight spaces and maximizing board real estate.

No. of Terminals: 400

High number of terminals allow for versatile connectivity options and enhanced functionality of the product.

Minimum Supply Voltage: 1.35 V

Low minimum supply voltage requirement conserves power and improves energy efficiency of the product.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures performance in various environments and applications.

Minimum Operating Temperature: -20 °C

Wide range of operating temperatures allows for use in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER finish provides excellent conductivity, preventing signal loss and ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier mounting and soldering processes, enhancing overall product assembly.

Maximum Seated Height: 1.53 mm

Low profile design with maximum seated height of 1.53mm saves space and enables sleek product designs.

Width: 17 mm

Optimal width of 17mm allows for compact integration into various electronic devices and systems.

Maximum Time At Peak Reflow Temperature (s): 40

Capable of withstanding peak reflow temperatures for up to 40 seconds, ensuring proper soldering and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C enables secure solder joints and robust connections.

Length: 17 mm

Length of 17mm provides a balanced form factor, suitable for a wide range of electronic applications.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade allows for reliable operation in demanding industrial environments.

Peripheral IC Type: SoC

System-on-Chip (SoC) design integrates multiple functionalities into a single device, simplifying system design and reducing costs.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, enhancing the overall performance and durability of the product.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm enables high-density mounting and precise connections, improving overall product reliability.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates that the product has medium sensitivity to moisture exposure, suitable for standard manufacturing and storage conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6X3EVN10AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.53 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6X3EVN10AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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