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XC7Z010-3CLG225E

Xilinx

XC7Z010-3CLG225E by Xilinx

The Xilinx XC7Z010-3CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

Median Price

$116.640

Lifecycle Status

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7

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Farnell

UK . 575 parts In-Stock

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$87.050

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$83.570

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$80.090

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Mouser Electronics

USA . 4 parts In-Stock

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Element14

Singapore . 575 parts In-Stock

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Digiode

USA . 273 parts In-Stock

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$82.698

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VNN

France . 824 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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MARBEL Systems

Belgium . 259 parts In-Stock

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$22.222

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Texas Native Microelectronics

USA . 869 parts In-Stock

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$22.477

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Aztec Data Supply Inc.

USA . 313 parts In-Stock

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$28.610

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Kenton Components

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$30.650

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$67.133

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$63.777

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Qasali Group International

UK . 1,424 parts In-Stock

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$68.963

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Corohmni

South Africa . 147 parts In-Stock

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Ampacity Inc.

Singapore . 432 parts In-Stock

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$73.990

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Semicontronic

India . 184 parts In-Stock

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$72.140

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Continental Prestige Electronics

USA . 575 parts In-Stock

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$76.230

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Corphita

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Vigor

Singapore . 871 parts In-Stock

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Netroflash

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Modulus Dynamics

Lithuania . 248 parts In-Stock

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Microchip USA

USA . 1,855 parts In-Stock

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Argo Parts USA

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

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Supply Digital

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Overview

Elevate your projects with the XC7Z010-3CLG225E by Xilinx, a top-tier manufacturer known for its cutting-edge technology. This versatile System on Chip offers endless possibilities in the realm of Other Function uPs, uCs & Peripheral ICs. With a maximum supply voltage of 1.05 V and a sleek package style, this product is designed to elevate performance while maximizing efficiency. Explore new horizons and experience unparalleled quality with the XC7Z010-3CLG225E - the perfect solution for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside the package, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation of the product on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for flexibility in power input options, making the product suitable for a variety of applications.

Package Shape: SQUARE

The square shape of the package allows for easier integration into circuit designs, optimizing space and layout efficiency.

No. of Terminals: 225

Having a high number of terminals enables more connectivity options and functionality, making the product versatile and adaptable to different requirements.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures efficient power consumption and operation, making the product energy-efficient and cost-effective.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows the product to withstand challenging environmental conditions, ensuring reliable performance in a range of settings.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the product can function effectively in cold environments without risk of damage or malfunction.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections during installation, enhancing the overall stability and reliability of the product.

Maximum Seated Height: 1.5 mm

The low maximum seated height allows for a compact and streamlined design, reducing the overall profile of the product and enabling efficient use of space.

Width: 13 mm

The moderate width of the product provides a balance between size and functionality, making it suitable for a range of applications without compromising on performance.

Length: 13 mm

The relatively small length of the product contributes to its compact and space-saving design, allowing for easy integration into various systems and devices.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions and components into a single unit, simplifying the overall system architecture and enhancing efficiency.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption and high noise immunity, ensuring reliable and energy-efficient operation of the product.

Terminal Form: BALL

The ball terminal form provides stable and reliable connections, reducing the risk of signal loss or interference and enhancing the overall performance of the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V is ideal for a wide range of applications, providing a standard power input that is compatible with various devices and systems.

Terminal Pitch: 0.8 mm

The close terminal pitch allows for high-density packaging and increased connectivity options, making the product suitable for complex and space-constrained designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z010-3CLG225E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B225

Length:

13 mm

No. of Terminals:

225

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA225,15X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XC7Z010-3CLG225E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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