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MCIMX6X2AVN08AB

NXP Semiconductors

MCIMX6X2AVN08AB by NXP Semiconductors

MCIMX6X2AVN08AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for automotive applications due to its low profile and fine pitch package style.

Median Price

$19.930

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 220 parts In-Stock

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Verical

USA . 220 parts In-Stock

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Chip1Stop

Japan . 220 parts In-Stock

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$39.780

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$26.400

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$26.400

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Nova Conductors

Japan . 63 parts In-Stock

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$33.998

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Digiode

USA . 482 parts In-Stock

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Vyrian

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Anansix

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Flip Electronics

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AZTECH Wire

Italy . 428 parts In-Stock

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$17.937

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Aztec Data Supply Inc.

USA . 3,015 parts In-Stock

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$26.168

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One Stop Electronics

USA . 220 parts In-Stock

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$33.440

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Ampacity Inc.

Singapore . 220 parts In-Stock

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Semicontronic

India . 68 parts In-Stock

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$32.604

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$32.437

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$32.437

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Continental Prestige Electronics

USA . 1,056 parts In-Stock

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$33.318

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

USA . 3,324 parts In-Stock

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Corohmni

South Africa . 3,219 parts In-Stock

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Microchip USA

USA . 2,383 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

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iodParts Technologies Inc.

India . 3,500 parts In-Stock

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Argo Parts USA

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Kepictronics

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Overview

Discover the cutting-edge technology of the MCIMX6X2AVN08AB by NXP Semiconductors, a top-tier manufacturer known for its quality and innovation. This versatile System on Chip peripheral IC offers endless possibilities for applications in the automotive industry and beyond. With a low profile, fine pitch package style and a wide temperature range, this product ensures reliable performance in any environment. Experience the value and benefits of this advanced IC today and stay ahead of the competition with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and lightweight design, making the product suitable for a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into electronic circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.5 V

The low maximum supply voltage helps in reducing power consumption and heat generation, improving overall efficiency of the product.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, contributing to a compact and organized design.

No. of Terminals: 400

The high number of terminals provides ample connectivity options, allowing for versatile connectivity and functionality in electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances signal integrity and reliability, making the product suitable for high performance applications.

Minimum Supply Voltage: 1.275 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the product flexible and adaptable in different scenarios.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in challenging environments, ensuring the product's durability and stability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the product to function effectively in cold conditions, expanding its operational range and versatility.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finish materials ensures good conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Terminal Position: BOTTOM

The bottom terminal position allows for easy soldering and secure connection, facilitating quick and efficient installation of the product on circuit boards.

Maximum Seated Height: 1.53 mm

The low maximum seated height contributes to a slim and compact profile, making the product suitable for applications where space is limited.

Width: 17 mm

The standard width dimension ensures compatibility with standard electronic components and circuit board layouts, simplifying integration and assembly.

Maximum Time At Peak Reflow Temperature (s): 40

The short maximum time at peak reflow temperature helps in preventing overheating and damage to the product during the assembly process, ensuring product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust and reliable soldering during assembly, ensuring strong and durable connections for the product.

Length: 17 mm

The standard length dimension facilitates compatibility and easy integration of the product into electronic systems, leading to a streamlined and efficient design.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the product is suitable for use in automotive applications, ensuring reliable performance under extreme temperature conditions.

Peripheral IC Type: SYSTEM ON CHIP

The system on chip design integrates multiple functions into a single chip, leading to reduced board space requirements and improved system performance.

Technology: CMOS

The CMOS technology offers low power consumption, high speed operation, and compatibility with a wide range of devices, making the product efficient and versatile.

Terminal Form: BALL

The ball terminal form allows for reliable and secure connections, ensuring stable and consistent performance of the product in electronic systems.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a stable operating voltage for the product, ensuring consistent and reliable performance in various electronic applications.

Terminal Pitch: 0.8 mm

The small terminal pitch enables compact packaging and efficient space utilization, making the product suitable for miniaturized electronic devices and systems.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product has moderate sensitivity to moisture exposure, requiring proper handling and storage to maintain performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6X2AVN08AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.53 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCIMX6X2AVN08AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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