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XC7Z030-L2FBG676I

Xilinx

XC7Z030-L2FBG676I by Xilinx

The Xilinx XC7Z030-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

Median Price

$517.450

Lifecycle Status

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4

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1k+

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Digiode

USA . 238 parts In-Stock

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VNN

France . 424 parts In-Stock

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$517.450

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 375 parts In-Stock

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$13.922

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Aztec Data Supply Inc.

USA . 755 parts In-Stock

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Corohmni

South Africa . 192 parts In-Stock

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Modulus Dynamics

Lithuania . 325 parts In-Stock

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Texas Native Microelectronics

USA . 894 parts In-Stock

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$174.191

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Advanced Electronics

New Zealand . 40 parts In-Stock

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Kenton Components

USA . 605 parts In-Stock

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$209.029

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Vigor

Singapore . 427 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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Corphita

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Qasali Group International

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Continental Prestige Electronics

USA . 5,421 parts In-Stock

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Argo Parts USA

USA . 1,395 parts In-Stock

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$501.854

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Netroflash

USA . 2,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Supply Digital

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Kepictronics

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Authorized Procurement Solutions

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MARBEL Systems

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Overview

Unlock endless possibilities with the XC7Z030-L2FBG676I by Xilinx. This innovative system on chip offers unparalleled quality and reliability, ensuring top-notch performance for a wide range of applications. Whether you're in the market for cutting-edge uPs, uCs, or peripheral ICs, this versatile product has you covered. With its advanced technology and state-of-the-art design, the XC7Z030-L2FBG676I delivers unmatched value, benefits, and advantages to customers looking to take their projects to the next level. Elevate your designs with Xilinx today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient installation, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

Provides a wide operating voltage range for flexibility in different power supply setups.

Package Shape: SQUARE

The square shape makes it easy to integrate into circuit designs, optimizing space usage.

No. of Terminals: 676

Offers a high number of terminals for connection versatility and compatibility with a wide range of systems.

Package Style (Meter): GRID ARRAY

Grid array package style enhances thermal performance and robustness for reliable operation.

Minimum Supply Voltage: 0.95 V

With a low minimum supply voltage, the product is energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures stable performance in demanding environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the product to function reliably in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and integration into complex systems.

Maximum Seated Height: 2.54 mm

Low seated height enables compact and slim device designs without compromising performance.

Width: 27 mm

Compact width dimensions make the product suitable for space-constrained applications.

Length: 27 mm

The length of 27 mm provides a balanced form factor for easy integration into various setups.

Peripheral IC Type: SYSTEM ON CHIP

A system-on-chip design streamlines system complexity, reducing component count and improving efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall system performance.

Terminal Form: BALL

Ball terminal form simplifies assembly and ensures secure connections for stable operation.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V is ideal for a wide range of applications, striking a balance between performance and efficiency.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for high-density packaging, maximizing functionality in compact designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-L2FBG676I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-L2FBG676I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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