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XC7Z030-2FFG676I

Xilinx

XC7Z030-2FFG676I by Xilinx

Xilinx XC7Z030-2FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

Median Price

$592.680

Lifecycle Status

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Element14

Singapore . 50 parts In-Stock

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 238 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 247 parts In-Stock

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Modulus Dynamics

Lithuania . 233 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 1,428 parts In-Stock

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Corphita

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Microchip USA

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Qasali Group International

UK . 4,463 parts In-Stock

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Semicontronic

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Ampacity Inc.

Singapore . 90 parts In-Stock

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One Stop Electronics

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Continental Prestige Electronics

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Argo Parts USA

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Lixinc

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iodParts Technologies Inc.

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RC Electronics

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Overview

Unlock limitless possibilities with the XC7Z030-2FFG676I by Xilinx. As a leader in the industry, Xilinx ensures top-notch quality and reliability in every product they create. This versatile system on chip offers unparalleled performance and efficiency, making it ideal for a wide range of applications. From IoT devices to industrial automation, this cutting-edge technology delivers unmatched value and benefits to customers looking to revolutionize their projects. Experience innovation like never before with the XC7Z030-2FFG676I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and good electrical insulation, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 1.05 V

With a high maximum supply voltage, the product can handle a wide range of power inputs, increasing versatility in different applications.

Package Shape: SQUARE

Square package shape provides a compact design, allowing for space-saving installation in electronic devices.

No. of Terminals: 676

Having a high number of terminals enables the product to interface with numerous external components, enhancing connectivity and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient heat dissipation and mechanical stability, improving overall performance and reliability of the product.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage ensures efficient power consumption and supports operation in low-power environments, enhancing energy efficiency.

Maximum Operating Temperature: 100 °C

High maximum operating temperature allows the product to withstand elevated heat levels, ensuring stable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range capability enables the product to operate in extreme cold environments without compromising functionality, making it suitable for diverse applications.

Terminal Position: BOTTOM

Bottom terminal position provides easy access for soldering and board mounting, simplifying assembly processes and improving overall product reliability.

Maximum Seated Height: 3.24 mm

Low maximum seated height offers a slim profile for the product, allowing for compact integration in small spaces without sacrificing performance.

Width: 27 mm

Standard width dimension facilitates compatibility with industry-standard board layouts and connectors, ensuring easy integration into existing electronic systems.

Length: 27 mm

Standard length dimension enables seamless placement of the product on circuit boards, optimizing space utilization and enhancing overall system efficiency.

Peripheral IC Type: SYSTEM ON CHIP

System-on-chip integration combines multiple functions into a single IC, reducing component count and board space requirements, simplifying system design and enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for a wide range of applications.

Terminal Form: BALL

Ball terminal form ensures secure connections and reliable solder joints, improving overall signal integrity and durability of the product.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation of the product, preventing voltage fluctuations and potential system failures.

Terminal Pitch: 1 mm

Narrow terminal pitch allows for high-density mounting, enabling compact design and efficient use of board space, making the product suitable for compact electronic devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-2FFG676I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-2FFG676I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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